HIP2500IP HARRIS [Harris Corporation], HIP2500IP Datasheet - Page 9

• Manufacturer Part Number: HIP2500IP
• Description: Half Bridge 500VDC Driver
• Manufacturer: HARRIS [Harris Corporation]

N
1
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
2
-A-
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
sions are not necessarily exact.
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
H
A1
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
HIP2500
9
M16.3
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
e
h
L
(JEDEC MS-013-AA ISSUE C)
0.0926
0.0040
0.013
0.0091
0.3977
0.2914
0.394
0.010
0.016
MIN
0
o
0.050 BSC
INCHES
16
0.1043
0.0118
0.0200
0.0125
0.4133
0.2992
0.419
0.029
0.050
MAX
8
o
10.10
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
MILLIMETERS
0
o
1.27 BSC
16
10.50
10.65
2.65
0.30
0.51
0.32
7.60
0.75
1.27
MAX
8
o
Rev. 0 12/93
NOTES
9
3
4
5
6
7
-
-
-
-
-
-