HIP6301CBZA-T INTERSIL [Intersil Corporation], HIP6301CBZA-T Datasheet - Page 17
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HIP6301CBZA-T
Manufacturer Part Number
HIP6301CBZA-T
Description
Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HIP6301CBZA-T.pdf
(17 pages)
N
1
Small Outline Plastic Packages (SOIC)
NOTES:
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
10. Controlling dimension: MILLIMETER. Converted inch dimen-
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
2
-A-
INDEX
AREA
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
sions are not necessarily exact.
3
e
B
D
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
SEATING PLANE
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
M
-C-
E
-B-
For information regarding Intersil Corporation and its products, see www.intersil.com
B S
A
17
H
A1
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
HIP6301
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AC ISSUE C)
0.0926
0.0040
0.014
0.0091
0.4961
0.2914
0.394
0.010
0.016
MIN
0
o
0.050 BSC
INCHES
20
0.1043
0.0118
0.019
0.0125
0.5118
0.2992
0.419
0.029
0.050
MAX
8
o
12.60
10.00
2.35
0.10
0.35
0.23
7.40
0.25
0.40
MIN
MILLIMETERS
0
o
1.27 BSC
20
13.00
10.65
2.65
0.30
0.49
0.32
7.60
0.75
1.27
MAX
8
o
December 27, 2004
Rev. 1 1/02
NOTES
FN4765.6
9
3
4
5
6
7
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