MC15XS3400 FREESCALE [Freescale Semiconductor, Inc], MC15XS3400 Datasheet

no-image

MC15XS3400

Manufacturer Part Number
MC15XS3400
Description
Quad High Side Switch (Quad 15m?)
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC15XS3400DH
Manufacturer:
FREESCALE
Quantity:
20 000
Freescale Semiconductor
Advance Information
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Quad High Side Switch
(Quad 15mΩ)
automotive lighting applications. Its four low R
15 mΩ) can control four separate 55W / 28W bulbs, and/or Xenon
modules, and/or LEDs.
16-bit SPI interface. Its output with selectable slew-rate improves
electromagnetic compatibility (EMC) behavior. Additionally, each
output has its own parallel input or SPI control for pulse-width
modulation (PWM) control if desired. The 15XS3400 allows the user to
program via the SPI the fault current trip levels and duration of
acceptable lamp inrush. The device has Fail-safe mode to provide fail-
safe functionality of the outputs in case of MCU damaged.
Features
The 15XS3400 is one in a family of devices designed for low-voltage
Programming, control and diagnostics are accomplished using a
• Four protected 15mΩ high side switches (at 25°C)
• Operating voltage range of 6.0V to 20V with standby current
• 8MHz 16-bit 3.3V and 5V SPI control and status reporting with
• PWM module using external clock or calibratable internal
• Smart over-current shutdown, severe short-circuit, over-
• Output OFF or ON open-load detection compliant to bulbs or leds
< 5.0μA, extended mode from 4.0V to 28V
daisy chain capability
oscillator with programmable outputs delay management
temperature protections with time limited autoretry, and Fail-safe
mode in case of MCU damage
and short to battery detection. Analog current feedback with
selectable ratio and board temperature feedback.
MCU
GND
Figure 1. 15XS3400 Simplified Application Diagram
V
DD
SCLK
A/D
SO
CS
I/O
I/O
I/O
I/O
I/O
I/O
SI
DS(ON)
V
DD
MOSFETs (quad
V
PWR
WAKE
FS
SCLK
CS
SO
RST
SI
IN0
IN1
IN2
IN3
CSNS
FSI
VDD
V
DD
15XS3400
GND
MC15XS3400CPNA
VPWR
V
PWR
HS0
HS1
HS2
HS3
Device
ORDERING INFORMATION
HIGH SIDE SWITCH
15XS3400
Document Number: MC15XS3400
LOAD
LOAD
LOAD
LOAD
98ARL10596D
24-PIN PQFN
PNA SUFFIX
- 40°C to 125°C
Temperature
Range (T
A
)
Rev. 7.0, 12/2008
Package
24 PQFN

Related parts for MC15XS3400

MC15XS3400 Summary of contents

Page 1

... I/O RST SO SI I/O IN0 I/O IN1 I/O IN2 I/O IN3 A/D CSNS FSI GND Document Number: MC15XS3400 Rev. 7.0, 12/2008 15XS3400 HIGH SIDE SWITCH PNA SUFFIX 98ARL10596D 24-PIN PQFN ORDERING INFORMATION Temperature Device Package Range ( 40°C to 125°C 24 PQFN PWR HS0 LOAD HS1 LOAD ...

Page 2

INTERNAL BLOCK DIAGRAM VDD V Failure Detection CS SCLK I DWN SO SI RST WAKE FS IN0 IN1 IN2 IN3 DWN DWN DWN PWM Module Calibratable Oscillator V REG Programmable FSI Watchdog Over-temperature Prewarning ...

Page 3

Transparent Top View of Package SO GND HS3 Table 1. 15XS3400 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 21. Pin Pin Pin Name Number Function 1 CSNS ...

Page 4

PIN CONNECTIONS Table 1. 15XS3400 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 21. Pin Pin Pin Name Number Function 14, 17, 23 GND Ground Positive Power ...

Page 5

Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS V Supply Voltage Range PWR Load Dump at 25°C (400ms) ...

Page 6

ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings THERMAL RESISTANCE (5) Thermal Resistance Junction to ...

Page 7

STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER INPUTS Battery Supply Voltage Range Fully Operational (7) Extended ...

Page 8

ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic OUTPUTS HS0 TO HS3 ( Output Drain-to-Source ...

Page 9

Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic Current Sense Ratio (6.0V < < 20V, CSNS < 5.0V) HS[0:3] 28W ...

Page 10

ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic OUTPUTS HS0 TO HS3 (continued) C Current ...

Page 11

Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic CONTROL INTERFACE (17) Input Logic High Voltage (17) Input Logic Low Voltage ...

Page 12

ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO ...

Page 13

Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED) (26) Fault Detection Blanking Time ...

Page 14

ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic Output Over-current Time Step for 28W bit ...

Page 15

Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic Bulb Cooling Time Step for 28W bit = 0 CB[1:0]= ...

Page 16

ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic PWM MODULE TIMING Input PWM Clock Range ...

Page 17

Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic (34) SPI INTERFACE CHARACTERISTICS Maximum Frequency of SPI Operation (35) Required Low ...

Page 18

ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS IN[0:3] high logic level low logic level CS high logic level low logic level V HS[0:3] V PWR V HS[0:3] 70% V PWR 30% V PWR I OCH 1 I OCH2 I OC1 Load I OC2 ...

Page 19

I OCH 1 I OCH2 I OC1 I OC2 I OC3 I OC4 I OCLO4 I OCLO3 I OCLO2 I OCLO1 RSTB RST 10% V 0.2 VDD TwRSTB t ENBL t W RST TENBL CS CSB 10% V 0.7VDD DD ...

Page 20

ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS 90% V 3.5V SCLK SCLK SO 0.2 VDD SO 10% V Low-to-High Low to High SO SO 90% V 0.7 VDD High to Low High-to-Low Figure 8. SCLK Waveform and Valid SO Data Delay Time 15XS3400 ...

Page 21

The 15XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (quad 15mΩ) can control four separate DS(ON) 55W / 28W bulbs and/or Xenon modules. Programming, control and diagnostics are accomplished ...

Page 22

FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION GROUND (GND) These pins are the ground for the device. POSITIVE POWER SUPPLY (VPWR) This pin connects to the positive power supply and is the source of operational power for the device. The VPWR contact ...

Page 23

FUNCTIONAL INTERNAL BLOCK DESCRIPTION 15XS3400 - Functional Block Diagram MCU Interface & Output Control SPI Interface Power Supply POWER SUPPLY The 15XS3400 is designed to operate from 4.0V to 28V on the VPWR pin. Characteristics are provided from 6.0V to ...

Page 24

FUNCTIONAL DEVICE OPERATION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL DEVICE OPERATION SPI PROTOCOL DESCRIPTION The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Input (SI), Serial Output (SO), Serial Clock (SCLK), ...

Page 25

The 15XS3400 has four operating modes: Sleep, Normal, Fail-safe and Fault. Table 5 and Figure 11 contained in succeeding paragraphs. The Figure 10 describes an internal signal called IN_ON[x] depending on IN[x] input. IN[x] IN_ON[x] Figure 10. IN_ON[x] internal signal ...

Page 26

FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES In the event of an external VPWR supply disconnect, an unexpected current consumption may sink on the VDD supply pin (In Sleep State). This current leakage is about 70mA instead of 5.0µA and it may ...

Page 27

FAIL-SAFE MODE The 15XS3400 is in Fail-safe mode when: • within the normal voltage range, PWR • wake- • fail = 1, • fault = 0. Watchdog If the FSI input is not grounded, the watchdog ...

Page 28

FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FAULT MODE The 15XS3400 is in Fault mode when: • V and V are within the normal voltage range, PWR DD • wake- • fail = X, • fault=1. This device indicates the ...

Page 29

PROTECTION AND DIAGNOSTIC FEATURES PROTECTIONS Over-temperature Fault The 15XS3400 incorporates over-temperature detection and shutdown circuitry for each output structure. Two cases need to be considered when the output temperature is higher than • If the output command ...

Page 30

FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES The SPI fault report (SC[0:3] bits) is removed after a read operation. Over-voltage Fault (Enabled by default) By default, the over-voltage protection is enabled. The 15XS3400 shuts down all outputs and FS will ...

Page 31

ShortVpwr=1 (fault_control=1 and OV=0) or OV=1) OFF if hson=0 (fault_control=0 or OV=1) (fault_control=0) AUTO-RETRY The auto-retry circuitry is used to reactivate the output(s) automatically in case of over-current or over-temperature or under-voltage failure conditions to provide a high ...

Page 32

FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES Open-load Detection In On State The ON output open-load current thresholds can be chosen by SPI to detect a standard bulbs or LEDs (OLLED[0:3] bit set to logic [1]). In cases where the ...

Page 33

SERIAL INPUT COMMUNICATION SPI communication is accomplished using 16-bit messages. A message is transmitted by the MCU starting with the MSB D15 and ending with the LSB, D0 Each incoming command message on the SI pin can be interpreted using ...

Page 34

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS DEVICE REGISTER ADDRESSING The following section describes the possible register addresses (D[14:10]) and their impact on device operation. ADDRESS XX000 — STATUS REGISTER (STATR_S) The STATR register is used to read the device ...

Page 35

Table 14. Current Sense Ratio Selection CSNS_high_s (D0) Current Sense Ratio 0 CRS0 (default) 1 ADDRESS A A 100 — OUTPUT OVER-CURRENT 1 0 REGISTER (OCR) The OCR_s register allows the MCU to configure corresponding output over-current protection through the ...

Page 36

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 18. Over-current Mode Selection 1 inrush current and bulb cooling management ADDRESS 00101 — GLOBAL CONFIGURATION REGISTER (GCR) The GCR register allows the MCU to configure the device through the SPI. Bit ...

Page 37

Bits OD14:OD10 reflect the state of the bits SOA4 : SOA0 from the previously clocked in message. • Bit OD9 is set to logic [1] in Normal mode (NM). Table 22. Serial Output Bit Map Description Previous STATR SO ...

Page 38

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS PREVIOUS ADDRESS SOA4 : SOA0 = A (OCR_S) The returned data contains the programmed values in the OCR register for the output selected with A PREVIOUS ADDRESS SOA4 : SOA0 = 00101 (GCR) ...

Page 39

The following figure shows a typical automotive lighting application (only one vehicle corner) using an external PWM clock from the main MCU. A redundancy circuitry has been V PWR Voltage regulator 100nF 10µF 100nF 10k V ...

Page 40

PACKAGING SOLDERING INFORMATION The 15XS3400 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 15XS3400 was qualified in accordance with JEDEC standards J-STD-020C Sn-Pb reflow profile. The maximum For the ...

Page 41

Analog Integrated Circuit Device Data Freescale Semiconductor PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D PACKAGING PACKAGE DIMENSIONS 15XS3400 41 ...

Page 42

PACKAGING PACKAGE DIMENSIONS 15XS3400 42 PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D Figure 15. Package Mechanical Outline Analog Integrated Circuit Device Data Freescale Semiconductor ...

Page 43

Analog Integrated Circuit Device Data Freescale Semiconductor PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D PACKAGING PACKAGE DIMENSIONS 15XS3400 43 ...

Page 44

ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) Introduction This thermal addendum is provided as a supplement to the 15XS3400 technical data sheet. The addendum provides thermal performance information that may be critical in the design ...

Page 45

Figure 17. 1s JEDEC Thermal Test Board Layout Transparent Top View MC10XS3435 Pin Connections 24-PIN PQFN (12 x 12) 0.9 mm Pitch 12.0mm 12.0mm Body Analog Integrated Circuit Device Data Freescale Semiconductor Figure 18. 2s2p JDEC Thermal Test Board ...

Page 46

ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) Device on Thermal Test Board Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness Cu buried traces thickness 0.035mm Outline: 76.2mm x 114.3mm board area, including edge connector ...

Page 47

Figure 21. Transient Thermal 1W Step Response; Device on 1s JEDEC Standard Thermal Test Board with Heat Spreading Areas 600 Sq. mm 100 10 1 0.1 0.000001 Figure 22. Transient Thermal 1W Step Response; Device ...

Page 48

... Characteristics Table on page 8. • Added explanation for recovering to Sleep Mode on page 26. • Updated Outline Drawing to new Revision. • Changed Orderale Part Number from PC15XS3400CPNA to MC15XS3400CPNA on page 1. 12/2008 7.0 • Removed Pb-Free throughout document. This device is not Pb-free. • Changed V 0.8 to Min = 2.2, Typ = 2.5 and Max = 2.8 on Page 7. ...

Page 49

How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter ...

Related keywords