MC15XS3400 FREESCALE [Freescale Semiconductor, Inc], MC15XS3400 Datasheet - Page 46

• Manufacturer Part Number: MC15XS3400
• Description: Quad High Side Switch (Quad 15m?)
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Device on Thermal Test Board
46
15XS3400
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Material:
Outline:
Area A:
Ambient Conditions:
Figure 20. Steady State Thermal Resistance in Dependance on Heat Streading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness 0.035mm
76.2mm x 114.3mm board area,
including edge connector for thermal
testing, 74mm x 74mm buried layers
area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 25. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θ
JA mn
θJA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip
m = 1,
46.55
41.64
40.22
38.88
38.32
500
n = 1
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
600
37.10
33.07
32.01
30.64
30.49
m = 2,
53.82
50.74
49.89
48.99
48.18
n = 2
(°C/W)