HCS374D/SAMPLE INTERSIL [Intersil Corporation], HCS374D/SAMPLE Datasheet
HCS374D/SAMPLE
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HCS374D/SAMPLE Summary of contents
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... SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS374DMSR HCS374KMSR HCS374D/Sample HCS374K/Sample HCS374HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1995, 1999, 2004 HCS374MS Radiation Hardened Octal D-Type ...
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Functional Diagram ( 13, 14, 17, 18) D COMMON CONTROLS =High Level (Steady State) L =Low Level (Steady State) X =Immaterial Z =High Impedance ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Clock to Q TPLH, VCC = 4.5V TPHL Enable to Output TPZL, VCC = 4.5V TPZH Disable to Output TPLZ VCC = 4.5V TPHZ VCC = 4.5V NOTES: 1. All voltages referenced ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate Group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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AC Timing Diagrams tr tf INPUT LEVEL 90 10% 10% TW TPLH VS Qn FIGURE 1. CLOCK TO OUTPUT DELAYS AND CLOCK PULSE WIDTH TTLH VOH 80% 20% OUTPUT VOL FIGURE 3. OUTPUT TRANSITION TIME AC Load ...
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Three-State Low Timing Diagrams VIH INPUT VS VIL TPZL VOZ VT OUTPUT VOL THREE-STATE LOW VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VT 2.25 VW 0.90 GND 0 VIL 0 Three-State High Timing Diagrams VIH INPUT VS ...
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Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: AlSi ± 1k Å Å Metal Thickness: 11k GLASSIVATION: Type: SiO 2 ± 2.6k Å Å Thickness: 13k WORST CASE CURRENT DENSITY < 2 A/cm BOND ...