HCS374D/SAMPLE INTERSIL [Intersil Corporation], HCS374D/SAMPLE Datasheet - Page 10
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HCS374D/SAMPLE
Manufacturer Part Number
HCS374D/SAMPLE
Description
Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HCS374DSAMPLE.pdf
(10 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
108 x 106 mils
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
< 2.0 x 10
100µm x 100µm
4 mils x 4 mils
The mask series for the HCS374 is TA14304B.
2
5
A/cm
D1 (4)
Q1 (5)
Q2 (6)
D2 (7)
Å
2
± 2.6k
Å
± 1k
Å
D0
(3)
Å
D3
(8)
Q3
(9)
Q0
(2)
HCS374MS
GND
(10)
HCS374MS
OE
(1)
10
(11)
CP
VCC
(20)
(12)
Q4
(19)
Q7
(13)
D4
Spec Number
(18) D7
(17) D6
(16) Q6
(15) Q5
(14) D5
518770