HCS20HMSR INTERSIL [Intersil Corporation], HCS20HMSR Datasheet - Page 8

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HCS20HMSR

Manufacturer Part Number
HCS20HMSR
Description
Radiation Hardened Dual 4-Input NAND Gate
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
87 x 88 mils
2.20mm x 2.24mm
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 x 4 mils
NC (3)
B1 (2)
C1 (4)
D1 (5)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
A1
(1)
(6)
Y1
HCS20MS
HCS20MS
GND
VCC
(14)
(7)
50
(13)
(8)
Y2
D2
Spec Number
(12) C2
(11) NC
(10) B2
(9) A2
518761

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