DSPIC30F2010 MICROCHIP [Microchip Technology], DSPIC30F2010 Datasheet - Page 190
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DSPIC30F2010
Manufacturer Part Number
DSPIC30F2010
Description
High-Performance, 16-Bit Digital Signal Controllers
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
1.DSPIC30F2010.pdf
(203 pages)
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dsPIC30F2010
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS70118G-page 188
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
§
Units
A2
A1
E1
D
n
p
A
E
h
L
B
c
2
1
D
L
MIN
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8