TS8388BCF ATMEL [ATMEL Corporation], TS8388BCF Datasheet - Page 53
![no-image](/images/no-image-200.jpg)
TS8388BCF
Manufacturer Part Number
TS8388BCF
Description
ADC 8-bit 1 GSPS
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
1.TS8388BCF.pdf
(57 pages)
- Current page: 53 of 57
- Download datasheet (2Mb)
Outline
Descriptions
Figure 54. Package Dimension – 68 Pins CBGA
2144C–BDC–04/03
Ball
A1 Index
other side
CBGA 68 package.
AL203 substrate.
Package design.
Corner balls (x4) are not connected (mechanical ball).
Balls : 1.27 mm pitch on 11x11 grid.
- A -
11
10
9
8
7
6
5
4
3
2
1
A
1.27
B
72x∅ D = 0.80 ± 0.10 mm
C
0.40
0.15
15.00 ± 0.15 mm
D
T A B
T
View balls side
E
(Position of array of balls / edges A and B)
(Position of balls within array)
7.84
F
G
H
J
K
L
Detail of
ball x2
- B -
Top side with
soldered R, C
devices
(using solder
Sn/Pb 63/37)
0.95 max
1.27 ref
0.63 ± 0.10
1.45 ± 0.12
- T -
Balls
Sn/Pb 63/37
All units in mm
AI203 Ceramic
Cap.
Glued and embedded
in substrate
TS8388B
Balls side
AI203 substrate
53
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