SST89V564RD-33-I-PJ SST [Silicon Storage Technology, Inc], SST89V564RD-33-I-PJ Datasheet - Page 65

• Manufacturer Part Number: SST89V564RD-33-I-PJ
• Description: FlashFlex51 MCU
• Manufacturer: SST [Silicon Storage Technology, Inc]

FlashFlex51 MCU
SST89E564RD / SST89V564RD / SST89E554RC / SST89V554RC
13.0 ELECTRICAL SPECIFICATION
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Voltage on EA# Pin to V
D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V
Transient Voltage (<20ns) on Any Other Pin to V
Maximum I
Maximum I
Package Power Dissipation Capability (T
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current
Note: This specification contains preliminary information on new products in production.
TABLE 13-1: O
TABLE 13-2: R
©2003 Silicon Storage Technology, Inc.
Symbol
T
V
f
Symbol
N
T
I
OSC
LTH
a
DD
DR
END
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
1
1
The specifications are subject to change without notice.
(Based on package heat transfer limitations, not device power consumption.
1
OL
OL
per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Description
Ambient Temperature Under Bias
Supply Voltage
Oscillator Frequency
Oscillator Frequency for in-application programming
ELIABILITY
PERATING
Parameter
Endurance
Data Retention
Latch Up
Standard
Industrial
SST89E5x4Rx
SST89V5x4Rx
SST89E5x4Rx
SST89V5x4Rx
SST89E5x4Rx
SST89V5x4Rx
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
R
1
C
ANGE
HARACTERISTICS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
a
= 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to V
Minimum Specification
65
100 + I
10,000
100
DD
Min.
-40
4.5
2.7
.25
.25
0
0
0
Cycles
Units
Years
mA
Max
+70
+85
5.5
3.6
40
33
40
33
Test Method
JEDEC Standard A117
JEDEC Standard A103
JEDEC Standard 78
S71207-04-000
Data Sheet
Unit
MHz
MHz
MHz
MHz
°
°
V
V
T13-1.1 1207
T13-2.0 1207
DD
DD
C
C
+0.5V
+1.0V
12/03