HCS125 Intersil Corporation, HCS125 Datasheet - Page 9

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HCS125

Manufacturer Part Number
HCS125
Description
Radiation Hardened Quad Buffer/ Three-State
Manufacturer
Intersil Corporation
Datasheet
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
92 x 91(mils)
2.34 x 2.31 (mm)
Type: AlSi
Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
4 x 4 (mils)
100 x 100
5
2
A/cm
m)
Å
Å
OE2 (4)
2
Y1 (3)
A2 (5)
1k
2.6k
Å
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Å
HCS125MS
HCS125MS
131
(12) A4
(11) Y4
(10) OE3
Spec Number
518831

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