HIP0050IB Intersil Corporation, HIP0050IB Datasheet - Page 7

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HIP0050IB

Manufacturer Part Number
HIP0050IB
Description
0.3A/50V Octal Low Side Power Driver with Serial Bus Control and Over-Current Fault Flag
Manufacturer
Intersil Corporation
Datasheet

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N
1
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
0.25(0.010)
2
-A-
INDEX
AREA
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
sions are not necessarily exact.
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
A
H
A1
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
HIP0050
7
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
C
D
H
N
A
B
E
e
h
L
(JEDEC MS-013-AD ISSUE C)
0.0926
0.0040
0.013
0.0091
0.5985
0.2914
0.394
0.010
0.016
MIN
0
o
0.05 BSC
INCHES
24
0.1043
0.0118
0.020
0.0125
0.6141
0.2992
0.419
0.029
0.050
MAX
8
o
15.20
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
MILLIMETERS
0
o
1.27 BSC
24
15.60
10.65
2.65
0.30
0.51
0.32
7.60
0.75
1.27
MAX
8
o
Rev. 0 12/93
NOTES
9
3
4
5
6
7
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-
-
-
-
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