LTM4606 LINER [Linear Technology], LTM4606 Datasheet - Page 17

• Manufacturer Part Number: LTM4606
• Description: Ultralow EMI 28VIN, 6A DC/DC ?Module
• Manufacturer: LINER [Linear Technology]

Table 3. 1.5V Output
DERATING CURVE
Figures 8, 10
Figures 8, 10
Figures 8, 10
Figures 9, 11
Figures 9, 11
Figures 9, 11
Table 4. 3.3V Output
DERATING CURVE
Figures 12, 14
Figures 12, 14
Figures 12, 14
Figures 13, 15
Figures 13, 15
Figures 13, 15
Layout Checklist/Example
The high integration of LTM4606 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
• Use large PCB copper areas for high current path, in-
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
• Use round corners for the PCB copper layer to minimize
• To minimize the EMI noise and reduce module thermal
• Do not put vias directly on pads, unless they are
Heat Sink Manufacturer
Wakefi eld Engineering
APPLICATIONS INFORMATION
cluding V
PCB conduction loss and thermal stress.
tors next to the V
high frequency noise.
unit.
the radiated noise.
stress, use multiple vias for interconnection between top
layer and other power layers on different locations.
capped.
IN
, PGND and V
D
, PGND and V
V
V
12, 24
12, 24
12, 24
12, 24
12, 24
12, 24
5, 12
5, 12
5, 12
5, 12
5, 12
5, 12
IN
IN
OUT
(V)
(V)
. It helps to minimize the
OUT
pins to minimize
Part No: LTN20069
POWER LOSS CURVE
POWER LOSS CURVE
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
• Use a separated SGND ground copper area for com-
• Place one or more high frequency ceramic capacitors
Figure 17 gives a good example of the recommended
layout. For load current below 3A, decouple the input
and output grounds. Use vias to connect GND pads to the
bottom layer, then connect to the right side of the module
as the output GND.
AIR FLOW (LFM)
AIR FLOW (LFM)
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
close to the connection into the system board.
200
400
200
400
200
400
200
400
0
0
0
0
V
GND
V
OUT
IN
Figure 17. Recommended PCB Layout
C
OUT
C
IN
Phone: [phone]
C
OUT
C
IN
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
HEAT SINK
HEAT SINK
None
None
None
None
None
None
LTM4606
θ
θ
JA
JA
4606 F17
13.5
13.5
9.5
(°C/W)
10
(°C/W)
11
10
10
9
7
5
7
5
SIGNAL
GND
17
4606f