EVAL-ADMP404Z AD [Analog Devices], EVAL-ADMP404Z Datasheet - Page 8

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EVAL-ADMP404Z

Manufacturer Part Number
EVAL-ADMP404Z
Description
Omnidirectional Microphone with Bottom Port and Analog Output
Manufacturer
AD [Analog Devices]
Datasheet
ADMP404
PCB LAND PATTERN LAYOUT
The recommended PCB land pattern for the ADMP404 should
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 9. Care should be taken to avoid
applying solder paste to the sound hole in the PCB. A suggested
1.90
1.22
0.68
Figure 10. Suggested Solder Paste Stencil Pattern Layout
1.22
0.8 × 0.6
0.2 × 45
0.90
Figure 9. PCB Land Pattern Layout
TYP
Rev. PrH | Page 8 of 12
1.52
1.52mm
0.225 CUT WIDTH (2×)
solder paste stencil pattern layout is shown in Figure 10. The
diameter of the sound hole in the PCB should be larger than the
diameter of the sound port of the microphone. A minimum
diameter of 0.5 mm is recommended.
Ø1.55
1.55/1.05 DIA.
Ø0.95
Preliminary Technical Data
0.61
0.61

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