UPD5738T6N-E2 NEC [NEC], UPD5738T6N-E2 Datasheet
UPD5738T6N-E2
Related parts for UPD5738T6N-E2
UPD5738T6N-E2 Summary of contents
Page 1
DESCRIPTION μ The PD5738T6N is a CMOS MMIC DPDT (Double Pole Double Throw) switch which is developed for mobile communications, wireless communications and another RF switching applications. This device can operate within frequency from 0.01 to 2.5 GHz, having low ...
Page 2
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View TRUTH TABLE V INPUT1−OUTPUT1, INPUT2−OUTPUT2 cont Low High Remark High: +2.8 V, Low ABSOLUTE MAXIMUM RATINGS (T Parameter Symbol ...
Page 3
ELECTRICAL CHARACTERISTICS (T = +25° cont ( 000 pF, unless otherwise specified) Parameter Symbol Insertion Loss 1 L Insertion Loss 2 L Insertion Loss 3 L Insertion ...
Page 4
EVALUATION CIRCUIT DC block 10 000 pF 1 INPUT1 V 2 cont RF bypass 1 000 pF OUTPUT1 3 DC block 10 000 pF Caution This IC has pull down resistances inside between each RF line and GND line, which ...
Page 5
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD INPUT1 INPUT1 Vcont V cont OUTPUT1 OUTPUT1 USING THE NEC EVALUATION BOARD Symbol Values C1 1 0000 000 pF OUTPUT2 WIDE BAND DPDT SWITCH EB ...
Page 6
TYPICAL CHARACTERISTICS ( Ω, DC blocking capacitors = 10 000 pF, unless otherwise specified INPUT1, 2–OUTPUT1, 2 INSERTION LOSS vs. FREQUENCY 0 –0.5 –1.0 –1.5 –2 cont ( ...
Page 7
INPUT1, 2–OUTPUT1, 2 INSERTION LOSS vs. FREQUENCY 0 –0.5 –1.0 –1.5 –2 –2.5 0 0.5 1.0 1.5 2.0 Frequency f (GHz) INPUT1, 2–OUTPUT1, 2 RETURN LOSS vs. FREQUENCY 0 –10 –20 –30 – ...
Page 8
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) Remark The mounting pad and solder mask layouts in this document are for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of ...
Page 9
PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (T6N) (UNIT: mm) (Top View) 1.5±0.1 (Side View) +0.03 0.37 0.2±0.1 –0.05 Remark A> Reference value Data Sheet PU10750EJ01V0DS μ PD5738T6N (Bottom View) 0.3±0.07 (0.24) 0.7±0.1 9 ...
Page 10
RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at peak ...
Page 11
The information in this document is current as of February, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most ...