HCTS153K INTERSIL [Intersil Corporation], HCTS153K Datasheet

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HCTS153K

Manufacturer Part Number
HCTS153K
Description
Radiation Hardened Dual 4-Input Multiplexer
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
September 1995
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
• Single Event Upset (SEU) Immunity < 2 x 10
• Dose Rate Survivability: >1 x 10
• Dose Rate Upset >10
• Latch-Up Free Under Any Conditions
• Fanout (Over Temperature Range)
• Military Temperature Range -55
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range 4.5V to 5.5V
• LSTTL Input Compatibility
• Input Current Levels Ii
Description
The Intersil HCTS153MS is a Radiation Hardened dual
4-to-1 line selector/multiplexer which selects one of four
sources for each section by the common select inputs, S0
and S1. When the enable inputs (1E, 2E) are high, the
outputs are in the low logic state.
The HCTS153MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCTS153MS is supplied in a 16 lead Ceramic flatpack
(K suffix) or a SBDIP Package (D suffix).
Ordering Information
HCTS153DMSR
HCTS153KMSR
HCTS153D/Sample
HCTS153K/Sample
HCTS153HMSR
Bit-Day (Typ)
- Standard Outputs 10 LSTTL Loads
- VIL = 0.8V Max
- VIH = VCC/2 Min
PART NUMBER
10
RAD (Si)/s 20ns Pulse
5 A at VOL, VOH
|
Copyright
TEMPERATURE RANGE
o
12
C to +125
©
-55
-55
RAD (Si)/s
Intersil Corporation 1999
o
o
C to +125
C to +125
+25
+25
+25
o
o
o
o
C
C
C
C
2
/mg
-9
o
o
C
C
Errors/
540
Pinouts
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
HCTS153MS
GND
SCREENING LEVEL
1I3
1I2
1I1
1I0
1E
S1
Y1
FLATPACK PACKAGE (FLATPACK)
16 LEAD CERAMIC DUAL-IN-LINE
16 LEAD CERAMIC METAL SEAL
METAL SEAL PACKAGE (SBDIP)
GND
1I3
1I2
1I1
1I0
MIL-STD-1835 CDFP4-F16
1E
S1
Y1
MIL-STD-1835 CDIP2-T16
1
2
3
4
5
6
7
8
Dual 4-Input Multiplexer
1
2
3
4
5
6
7
8
TOP VIEW
TOP VIEW
Radiation Hardened
16 Lead SBDIP
16 Lead Ceramic Flatpack
16 Lead SBDIP
16 Lead Ceramic Flatpack
Die
16
15
14
13
12
11
10
9
Spec Number
16
15
14
13
12
11
10
9
File Number
PACKAGE
VCC
2E
S0
2I3
2I2
2I1
2I0
Y2
VCC
2E
S0
2I3
2I2
2I1
2I0
Y2
518609
2463.2

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HCTS153K Summary of contents

Page 1

... The HCTS153MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS153DMSR HCTS153KMSR HCTS153D/Sample HCTS153K/Sample HCTS153HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | http://www.intersil.com or 407-727-9207 Copyright HCTS153MS Pinouts ...

Page 2

Functional Block Diagram 2E 2I3 2I2 VCC GND 9 SELECT INPUTS ...

Page 3

Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...

Page 4

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Input to Output TPHL VCC = 4.5V TPLH VCC = 4.5V Select to Output TPHL VCC = 4.5V TPLH VCC = 4.5V Enable to Data TPHL VCC = 4.5V TPLH VCC = ...

Page 5

TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...

Page 6

CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate group A inspection in ...

Page 7

Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...

Page 8

AC Timing Diagram VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCTS VCC 4.50 VIH 3.00 VS 1.30 VIL 0 GND 0 HCTS153MS AC Load Circuit DUT TPHL CL ...

Page 9

Die Characteristics DIE DIMENSIONS: 2.13mm x 2.13mm 84 mils x 84 mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm ...

Page 10

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, ...

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