HCTS153K INTERSIL [Intersil Corporation], HCTS153K Datasheet - Page 9
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HCTS153K
Manufacturer Part Number
HCTS153K
Description
Radiation Hardened Dual 4-Input Multiplexer
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HCTS153K.pdf
(10 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
2.13mm x 2.13mm
84 mils x 84 mils
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS153 is TA14469A.
1I3 (3)
1I2 (4)
1I1 (5)
1I0 (6)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
S1
(2)
(7)
Y1
HCTS153MS
1E
(1)
HCTS153MS
GND
548
(8)
VCC
(16)
(15)
2E
(9)
Y2
Spec Number
(14) S0
(13) 2I3
(12) 2I2
(11) 2I1
(10) 2I0
518609