UPG131G NEC [NEC], UPG131G Datasheet - Page 6

• Manufacturer Part Number: UPG131G
• Description: L-BAND DPDT MMIC SWITCH
• Manufacturer: NEC [NEC]

RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
6
Infrared Ray Reflow
VPS
Wave Soldering
Partial Heating Method
Note Exposure limit before soldering after dry-pack package is opened.
Caution Do not apply more than a single process at once, except for “partial heating method”.
This product should be soldered in the following recommended conditions. Other soldering methods and
Soldering process
Storage conditions: 25°C and relative humidity at 65% or less.
Peak package’s surface temperature: 235°C or below
Reflow time: 30 seconds or less (at 210°C)
Number of reflow process: 3, Exposure limit
Peak package’s surface temperature: 215°C or below
Reflow time: 40 seconds or less (at 200°C)
Number of reflow process: 3, Exposure limit
Solder temperature: 260°C or below
Flow time: 10 seconds or less
Number of flow process: 1, Exposure limit
Terminal temperature: 300°C
Flow time: 3 seconds or less (per one pin),
Exposure limit
Note
: None
Soldering Conditions
Note
Note
Note
: None
: None
: None
WS60-00-1
VP15-00-3
IR35-00-3
Symbol
PG139GV