EXC28BA121U PANASONIC [Panasonic Semiconductor], EXC28BA121U Datasheet - Page 3

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EXC28BA121U

Manufacturer Part Number
EXC28BA121U
Description
Chip Bead Array
Manufacturer
PANASONIC [Panasonic Semiconductor]
Datasheet
● Standard Quantity
● Embossed Carrier Taping
Embossed Carrier Dimensions (mm)
Standard Reel Dimensions (mm)
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
EXC28B
EXC28B
Circuit Confi guration
Packaging Methods (Taping)
t
2
EXC28B
Part Number
Part Number
8
1
t
Chip component
1
Part Number
7
2
Sprocket hole
6
3
U 1.20±0.15 2.25±0.15 8.0±0.2
U
U
4
5
φ
180
A
D
A
φA
0
–3.0
Embossed Carrier Taping
0
P
1
Compartment
Kind of Taping
B
P
8
1
60.0±1.0
2
φB
Tape running direction
P
7
2
0
W
6
3
13.0±0.5
3.5±0.1 1.75±0.10 4.0±0.1
φC
5
4
F
21.0±0.8
E
φD
● Taping Reel
Pitch (P
4 mm
P
1
1
)
2.0±0.5
E
2.0±0.1
E
P
2
φA
φC
9.0±0.3
4.0±0.1
P
W
0
φD
5000 pcs./reel
1.5±0.1 0.20±0.05 0.9±0.1
Quantity
φD
11.4±1.5
Chip Bead Array
0
T
t
1
W
T
1.2±0.2
Feb. 2006
t
t
t
2

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