EMIF06-VID01F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF06-VID01F2_08 Datasheet
EMIF06-VID01F2_08
Related parts for EMIF06-VID01F2_08
EMIF06-VID01F2_08 Summary of contents
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... R = 100 C = 16pF typ LINE Description The EMIF06-VID01F2 is a 6-line highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interference. The EMIF06-VID01F2 Flip Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection ...
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... per line dc, 1 MHz V line R 2/7 Parameter and test conditions = 25 °C) amb Parameter RM Test conditions = 30 mV OSC EMIF06-VID01F2 Value 125 - 150 Min. ...
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... EMIF06-VID01F2 Figure 3. S21 (dB) attenuation measurement Figure -10 -20 -30 -40 -50 -60 100k 1M 10M 100M f/Hz Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output (V in Input 10V/d Output 10V/d 200ns/d Figure 7. Junction capacitance versus reverse voltage applied (typical values) ...
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... Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK trademark. ECOPACK specifications are available at www.st.com. Figure 9. Flip Chip package dimensions 500 µm ± 50 250 µm ± 50 4/7 EMIF yy 315 µm ± 50 210 µm 2.92 mm ± 50 µm EMIF06-VID01F2 - xxx zz Fx ® 650 µm ± 65 ...
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... EMIF06-VID01F2 Figure 10. Footprint recommendations Copper pad diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter Figure 12. Flip Chip tape and reel specification 0.73 ± 0.05 All dimensions in mm ...
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... Order code EMIF06-VID01F2 5 Revision history Table 4. Document revision history Date 15-Feb-2005 28-Apr-2008 6/7 Marking Package GR Flip Chip Revision 1 First issue. Added ECOPACK statement. Updated 2 Figure 12. Reformatted to current standards. EMIF06-VID01F2 Weight Base qty Delivery mode 5.4 mg 5000 Tape and reel 7” Changes Figure 9, Figure 11, and ...
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... EMIF06-VID01F2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...