EMIF06-VID01F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF06-VID01F2_08 Datasheet - Page 4

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EMIF06-VID01F2_08

Manufacturer Part Number
EMIF06-VID01F2_08
Description
6-line IPAD, low capacitance EMI filter and ESD protection
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Ordering information scheme
2
3
4/7
Ordering information scheme
Figure 8.
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 9.
500 µm ± 50
250 µm ± 50
Ordering information scheme
Flip Chip package dimensions
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
2.92 mm ± 50 µm
315 µm ± 50
EMIF
yy
210 µm
-
xxx zz
650 µm ± 65
EMIF06-VID01F2
Fx
®

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