TFDU7100-TR3 VISHAY [Vishay Siliconix], TFDU7100-TR3 Datasheet - Page 9

• Manufacturer Part Number: TFDU7100-TR3
• Description: Infrared Transceiver Module (FIR, 4 Mbit/s) for IrDA combined with Remote Control Receiver (36 kHz to 38 kHz Carrier)
• Manufacturer: VISHAY [Vishay Siliconix]

Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU7100 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 5 and 6 are VISHAY's recommended profiles for
use with the TFDU7100 transceivers. For more
details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not recom-
mended. Ramp-up rates faster than 1.3 °C/s could
damage an optical part because the thermal conduc-
tivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
Document Number 84773
Rev. 1.1, 27-Sep-06
19535
Figure 4. Recommended Solder Profile for Sn/Pb soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
90 s max.
250
300
350
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
Current Derating Diagram
Figure 7 shows the maximum operating temperature
when the device is operated without external current
limiting resistor.
18097
19532
275
250
225
200
175
150
125
100
90
85
80
75
70
65
60
55
50
75
50
25
280
260
240
220
200
180
160
140
120
100
0
80
60
40
20
0
2.0
0
0
Figure 5. Solder Profile, RSS Recommendation
2 °C...3 °C/s
2.5
50
Figure 7. Current Derating Diagram
T ≥ 217 °C for 70 s max
50
T ≥ 255 °C for 10 s....30 s
Figure 6. RTS Recommendation
Operating Voltage [V] at duty cycle 20 %
3.0
100
1.3 °C/s
90 s...120 s
100
T
peak
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
Peak temperature T
3.5
Vishay Semiconductors
= 260 °C max
150
Time/s
Time/s
150
4.0
200
peak
TFDU7100
= 260 °C
4.5
70 s max.
30 s max.
200
< 4 °C/s
250
5.0
www.vishay.com
T peak = 260 °C
< 2 °C/s
2 °C...4 °C/s
250
300
5.5
350
300
6.0
9