PAN1311 PANASONIC [Panasonic Semiconductor], PAN1311 Datasheet

PAN1311

Manufacturer Part Number

PAN1311

Description

Bluetooth-Module

Manufacturer

PANASONIC [Panasonic Semiconductor]

Datasheet

1.PAN1311.pdf (2 pages)

Current page: 1 of 2
Download datasheet (397Kb)

www.pedeu.panasonic.de

wireless@eu.panasonic.com

(Picture shows similar module)

Bluetooth-Module PAN1311



Design and Specifications are subject to change without notice. Ask the factory for technical specifications before purchase and/or use. If there is any doubt

regarding the safety of this product, kindly inform us immediately for technical consultation.

Now you can integrate Bluetooth very easy in your final

product, with the PAN1311-SPP as a full Bluetooth system

solution.

In comparison to our pin compatible HCI solution (PAN1310),

there is no longer a powerful host needed.

The PAN1311 is manufactured in a 11,6 x 8,7 x 1.8 mm³ SMD

LGA package with shielded case and will be qualified to the

Bluetooth 2.0 standard.

Due to a very low price PAN1311 is well suited for units

produced in all quantities, with the simple AT command set

you are able to integrate PAN1311 into your application.

This module follows the national and international

regulations, e.g. EMC, Safety, EN300328, FCC.

General

- Supported Profiles: RFCOMM, SPP device A and B

- Complete Bluetooth 2.0 + EDR solution

- Ultra low power design

- Temperature from -40°C to +70°C, optional +85°C (Industrial Range)

- No external components except antenna is needed

- Integrates ARM7TDMI, RAM and patchable 256k EEPROM

- On-module voltage regulator. External supply 2.7-3.6V

- Reference clock included

- Low power clock from internal oscillator or external low power clock

Interfaces

- 3.25 MBaud UART

- General purpose I/Os with interrupt and wake-up capabilities

- JTAG for boundary scan and debug

Bluetooth

- Scatternet with one slave role while still being visible

- Power control and RSSI

- Sniff mode, Adaptive Frequency Hopping and Quality of Service

- PAN1311 with SPP and max. +70°C

- PAN1311 with SPP and max. +85°C

OUTLINES - ENW89810J5CF

FEATURES

ORDERING CODE

(for device configuration data and application)

Hardware Status:

Mass Production

Cut the Cable

ENW89810J5CF

(on request for higher demand)

PAN1311 Rev. B1

Related parts for PAN1311

PAN1311 Summary of contents

Page 1

... In comparison to our pin compatible HCI solution (PAN1310), there is no longer a powerful host needed. The PAN1311 is manufactured in a 11,6 x 8,7 x 1.8 mm³ SMD LGA package with shielded case and will be qualified to the Bluetooth 2.0 standard. Due to a very low price PAN1311 is well suited for units produced in all quantities, with the simple AT command set you are able to integrate PAN1311 into your application ...

Page 2

P  APPLICATIONS All Wireless Applications - Printer Adapters and Scanners - Printers - Access Points - Wireless Sensors BLOCK DIAGRAM TECHNICAL CHARACTERISTICS Parameter -3 Receiver Sensitivity (BER=10 ) Output Power Power Supply Ultra Low Power Mode ACL (Transmit 3-DH1) ...

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