PAN1311 PANASONIC [Panasonic Semiconductor], PAN1311 Datasheet
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PAN1311
Manufacturer Part Number
PAN1311
Description
Bluetooth-Module
Manufacturer
PANASONIC [Panasonic Semiconductor]
Datasheet
1.PAN1311.pdf
(2 pages)
P
www.pedeu.panasonic.de
wireless@eu.panasonic.com
(Picture shows similar module)
Bluetooth-Module PAN1311
Design and Specifications are subject to change without notice. Ask the factory for technical specifications before purchase and/or use. If there is any doubt
regarding the safety of this product, kindly inform us immediately for technical consultation.
Now you can integrate Bluetooth very easy in your final
product, with the PAN1311-SPP as a full Bluetooth system
solution.
In comparison to our pin compatible HCI solution (PAN1310),
there is no longer a powerful host needed.
The PAN1311 is manufactured in a 11,6 x 8,7 x 1.8 mm³ SMD
LGA package with shielded case and will be qualified to the
Bluetooth 2.0 standard.
Due to a very low price PAN1311 is well suited for units
produced in all quantities, with the simple AT command set
you are able to integrate PAN1311 into your application.
This module follows the national and international
regulations, e.g. EMC, Safety, EN300328, FCC.
General
- Supported Profiles: RFCOMM, SPP device A and B
- Complete Bluetooth 2.0 + EDR solution
- Ultra low power design
- Temperature from -40°C to +70°C, optional +85°C (Industrial Range)
- No external components except antenna is needed
- Integrates ARM7TDMI, RAM and patchable 256k EEPROM
- On-module voltage regulator. External supply 2.7-3.6V
- Reference clock included
- Low power clock from internal oscillator or external low power clock
Interfaces
- 3.25 MBaud UART
- General purpose I/Os with interrupt and wake-up capabilities
- JTAG for boundary scan and debug
Bluetooth
- Scatternet with one slave role while still being visible
- Power control and RSSI
- Sniff mode, Adaptive Frequency Hopping and Quality of Service
- PAN1311 with SPP and max. +70°C
- PAN1311 with SPP and max. +85°C
OUTLINES - ENW89810J5CF
FEATURES
ORDERING CODE
(for device configuration data and application)
Hardware Status:
Mass Production
Cut the Cable
ENW89810J5CF
(on request for higher demand)
PAN1311 Rev. B1
TM
Related parts for PAN1311
PAN1311 Summary of contents
Page 1
... In comparison to our pin compatible HCI solution (PAN1310), there is no longer a powerful host needed. The PAN1311 is manufactured in a 11,6 x 8,7 x 1.8 mm³ SMD LGA package with shielded case and will be qualified to the Bluetooth 2.0 standard. Due to a very low price PAN1311 is well suited for units produced in all quantities, with the simple AT command set you are able to integrate PAN1311 into your application ...
Page 2
P APPLICATIONS All Wireless Applications - Printer Adapters and Scanners - Printers - Access Points - Wireless Sensors BLOCK DIAGRAM TECHNICAL CHARACTERISTICS Parameter -3 Receiver Sensitivity (BER=10 ) Output Power Power Supply Ultra Low Power Mode ACL (Transmit 3-DH1) ...