STD6NC40-1 STMICROELECTRONICS [STMicroelectronics], STD6NC40-1 Datasheet - Page 2

• Manufacturer Part Number: STD6NC40-1
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STD6NC40
THERMAL DATA
AVALANCHE CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
ON (1)
DYNAMIC
2/9
Rthj-case
Rthc-sink
Rthj-amb
V
Symbol
Symbol
Symbol
Symbol
R
V
(BR)DSS
g
I
I
I
C
DS(on)
C
E
GS(th)
D(on)
C
fs
I
GSS
DSS
AR
T
oss
AS
rss
iss
(1)
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
(starting T
Drain-source
Breakdown Voltage
Zero Gate Voltage
Drain Current (V
Gate-body Leakage
Current (V
Gate Threshold Voltage
Static Drain-source On
Resistance
On State Drain Current
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
Parameter
Parameter
Parameter
j
DS
= 25 °C, I
= 0)
GS
= 0)
D
= I
j
max)
AR
Parameter
, V
DD
I
V
V
V
V
V
V
V
V
I
D
D
V
= 50 V)
DS
DS
GS
DS
GS
DS
GS
DS
DS
= 250 µA, V
=3A
= Max Rating
= Max Rating, T
= V
> I
> I
= ±30V
= 10V, I
= 10V
= 25V, f = 1 MHz, V
D(on)
D(on)
Test Conditions
Test Conditions
Test Conditions
GS
, I
D
x R
x R
D
= 3 A
GS
= 250µA
DS(on)max,
DS(on)max,
= 0
C
= 125 °C
GS
= 0
Min.
Min.
Min.
400
2
6
2.27
100
275
1.5
Max Value
320
Typ.
Typ.
0.75
Typ.
530
5.1
90
15
6
3
Max.
±100
Max.
Max.
50
1
4
1
°C/W
°C/W
°C/W
°C
Unit
Unit
Unit
Unit
mJ
µA
µA
nA
pF
pF
pF
A
V
V
A
S