A54SX08A-PQG208I Microsemi, A54SX08A-PQG208I Datasheet - Page 31

• Manufacturer Part Number: A54SX08A-PQG208I
• Description: Ic Fpga Sx 12k Gates 208-Pqfp
• Manufacturer: Microsemi

Thermal Characteristics
Introduction
The temperature variable in Actel Designer software refers to the junction temperature, not the ambient, case, or
board temperatures. This is an important distinction because dynamic and static power consumption will cause the
chip's junction to be higher than the ambient, case, or board temperatures.
between thermal resistance, temperature gradient and power.
Where:
Table 2-12 • Package Thermal Characteristics
Package Type
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Plastic Quad Flat Pack (PQFP)
Plastic Quad Flat Pack (PQFP) with Heat Spreader
Plastic Ball Grid Array (PBGA)
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)
Notes:
1. The A54SX08A PQ208 has no heat spreader.
2. The SX-A PQ208 package has a heat spreader for A54SX16A, A54SX32A, and A54SX72A.
θ
θ
T
T
T
P
J
A
C
JA
JC
=
=
= Junction temperature
= Ambient temperature
= Ambient temperature
= total power dissipated by the device
Junction-to-air thermal resistance
Junction-to-case thermal resistance
1
2
Count
Pin
100
144
176
208
208
329
144
256
484
θ
θ
JA
JA
=
=
v5.3
T
----------------- -
T
----------------
C
J
–
P
–
P
θ
3.8
3.8
3.8
3.2
14
11
11
8
3
JC
T
T
A
A
Still Air
33.5
33.5
24.7
26.1
16.2
17.1
26.9
26.6
18
EQ 2-9
200 ft./min.
1.0 m/s
and
27.4
19.9
22.5
13.3
13.8
22.9
22.8
14.7
28
θ
JA
EQ 2-10
500 ft./min.
2.5 m/s
give the relationship
25.7
20.8
11.9
12.8
21.5
21.5
13.6
25
18
SX-A Family FPGAs
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
EQ 2-10
EQ 2-9
2-11