MC10EP56MNG ON Semiconductor, MC10EP56MNG Datasheet - Page 10

• Manufacturer Part Number: MC10EP56MNG
• Description: IC MUX ECL DUAL DIFF 2:1 20-QFN
• Manufacturer: ON Semiconductor
• Series: 10EPr
• Type: Differential Digital Multiplexerr

Specifications of MC10EP56MNG

• Circuit: 2 x 2:1
• Independent Circuits: 1
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TFQFN Exposed Pad
• Product: Multiplexer
• Logic Family: ECL
• Number Of Lines (input / Output): 4.0 / 2.0
• Propagation Delay Time: 0.47 ns at 3 V to 5.5 V
• Supply Voltage (max): - 5.5 V, + 5.5 V
• Supply Voltage (min): - 3 V, + 3 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Input Lines: 4.0
• Number Of Output Lines: 2.0
• Logical Function: Mux
• Configuration: 1 x 4:1/2 x 2:1
• Number Of Inputs: 4
• Number Of Outputs: 2
• Operating Supply Voltage (typ): -3.3/-5/3.3/5V
• Operating Supply Voltage (min): -3/3V
• Operating Supply Voltage (max): -5.5/5.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

0.15 (0.006) T
0.15 (0.006) T
L
2X
−T−
U
PIN 1
IDENT
U
L/2
C
0.100 (0.004)
S
S
SEATING
PLANE
20
1
D
0.36
16X
20X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−V−
0.10 (0.004)
A
K
REF
G
H
M
10
11
PACKAGE DIMENSIONS
T
SOLDERING FOOTPRINT*
1
1.26
16X
U
http://onsemi.com
−U−
S
B
CASE 948E−02
V
TSSOP−20
ISSUE C
7.06
S
10
N
J J1
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
DETAIL E
SECTION N−N
F
0.25 (0.010)
DIMENSIONS: MILLIMETERS
K1
K
M
−W−
PITCH
0.65
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
J1
K1
M
A
B
C
D
F
G
H
K
L
J
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
---
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
---
0
0.026 BSC
0.252 BSC
_
INCHES
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
MAX
8
_