MC10EP56MNG ON Semiconductor, MC10EP56MNG Datasheet - Page 7

• Manufacturer Part Number: MC10EP56MNG
• Description: IC MUX ECL DUAL DIFF 2:1 20-QFN
• Manufacturer: ON Semiconductor
• Series: 10EPr
• Type: Differential Digital Multiplexerr

Specifications of MC10EP56MNG

• Circuit: 2 x 2:1
• Independent Circuits: 1
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TFQFN Exposed Pad
• Product: Multiplexer
• Logic Family: ECL
• Number Of Lines (input / Output): 4.0 / 2.0
• Propagation Delay Time: 0.47 ns at 3 V to 5.5 V
• Supply Voltage (max): - 5.5 V, + 5.5 V
• Supply Voltage (min): - 3 V, + 3 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Input Lines: 4.0
• Number Of Output Lines: 2.0
• Logical Function: Mux
• Configuration: 1 x 4:1/2 x 2:1
• Number Of Inputs: 4
• Number Of Outputs: 2
• Operating Supply Voltage (typ): -3.3/-5/3.3/5V
• Operating Supply Voltage (min): -3/3V
• Operating Supply Voltage (max): -5.5/5.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
20. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V
21. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
Table 9. AC CHARACTERISTICS
t
t
t
f
t
V
t
t
PLH
PHL
SKEW
Symbol
max
JITTER
r
f
PP
are measured from the cross point of the inputs to the cross point of the outputs.
,
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Maximum Frequency
(See Figure 2 F
Propagation Delay to
Output Differential
Within−Device Skew (Note 21)
Device to Device Skew
Random Clock Jitter
(See Figure 2 F
Input Voltage Swing
(Differential Configuration)
Output Rise/Fall Times
(20% − 80%)
Characteristic
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Figure 3. Typical Termination for Output Driver and Device Evaluation
Driver
Device
max
max
/JITTER)
/JITTER)
COM_SEL to Q, Q
1000
800
600
400
200
1.0
É É É É É É É É É É É É É É
V
SEL to Q, Q
Q
Q
CC
D to Q, Q
= 0 V; V
Q, Q
Figure 2. F
EE
1.5
= −3.0 V to −5.5 V or V
Min
250
250
250
150
70
Z
Z
http://onsemi.com
FREQUENCY (GHz)
o
o
= 50 W
= 50 W
−40°C
(JITTER)
Typ
340
340
350
800
120
max
> 3
0.2
50
3.3 V
5 V
2.0
50 W
V
7
/Jitter @ 255C
TT
= V
1200
Max
450
450
450
100
200
170
< 1
V
CC
TT
CC
− 2.0 V
50 W
Min
270
270
270
150
2.5
= 3.0 V to 5.5 V; V
80
25°C
Typ
360
340
360
800
130
> 3
0.2
50
CC
D
D
3.0
− 2.0 V.
1200
Max
470
470
470
100
200
180
10
< 1
9
8
7
6
5
4
3
É É É É
2
1
É É
0
EE
Receiver
Device
= 0 V (Note 20)
Min
300
300
300
150
100
85°C
Typ
400
400
400
800
150
> 3
0.2
50
1200
Max
500
500
500
100
200
230
< 1
Unit
GHz
mV
ps
ps
ps
ps