ISL8225MIRZ-T Intersil, ISL8225MIRZ-T Datasheet - Page 26

• Manufacturer Part Number: ISL8225MIRZ-T
• Description: ISL8225M Series 20 Vin 1.5 Mhz Dual 15 A Single 30 A Step-Down Power Module
• Manufacturer: Intersil

Reflow Parameters
Due to the low mount height of the QFN, "No Clean" Type 3 solder
paste, per ANSI/J-STD-005, is recommended. Nitrogen purge is
also recommended during reflow. A system board reflow profile
depends on the thermal mass of the entire populated board, so it
is not practical to define a specific soldering profile just for the
QFN. The profile given in Figure 41 is provided as a guideline to
customize for varying manufacturing practices and applications.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest revision.
About Intersil
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management
semiconductors. The company's products address some of the fastest growing markets within the industrial and infrastructure,
personal computing and high-end consumer markets. For more information about Intersil or to find out how to become a member of
our winning team, visit our website and career page at www.intersil.com.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective product information page.
Also, please check the product information page to ensure that you have the most updated datasheet:
To report errors or suggestions for this datasheet, please go to:
Reliability reports are available from our website at:
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
December 3, 2012
DATE
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
FN7822.0
REVISION
in the quality certifications found at
26
For information regarding Intersil Corporation and its products, see
Initial Release
For additional products, see
http://rel.intersil.com/reports/sear
ISL8225M
www.intersil.com/en/support/qualandreliability.html
www.intersil.com/askourstaff
www.intersil.com/en/products.html
300
250
200
150
100
50
0
0
SLOW RAMP (3°C/s MAX)
AND SOAK FROM +100°C
TO +180°C FOR 90s~120s
PEAK TEMPERATURE +230°C~+245°C;
TYPICALLY 60s-70s ABOVE +220°C
KEEP LESS THAN 30s WITHIN 5°C OF PEAK TEMP.
CHANGE
FIGURE 41. TYPICAL REFLOW PROFILE
100
RAMP RATE ≤1.5°C FROM +70°C TO +90°C
www.intersil.com
150
DURATION (s)
ISL8225M
200
250
300
December 3, 2012
FN7822.0
350