E910.54B37AB ELMOS Semiconductor, E910.54B37AB Datasheet - Page 25

• Manufacturer Part Number: E910.54B37AB
• Description: Interface - Specialized FlexRay Transceiver
• Manufacturer: ELMOS Semiconductor

Specifications of E910.54B37AB

• Rohs: yes
• Product Type: FlexRay Transceiver
• Operating Supply Voltage: 5 V
• Supply Current: 50 mA
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-14
• Minimum Operating Temperature: - 40 C

E910.54
contents
1 Pinout ....................................................................................................................................................................................................... 2
1.1 Pin description ................................................................................................................................................................................... .. 2
1.2 Pinout ................................................................................................................................................................................................... .. 3
2 Operating conditions .......................................................................................................................................................................... .. 3
2.1 Absolute maximum ratings ........................................................................................................................................................... .. 3
2.2 Recommended operating conditions ......................................................................................................................................... .. 4
3 Detailed electrical specification ...................................................................................................................................................... .. 5
3.1 Power supplies ................................................................................................................................................................................... .. 5
3.2 Bus driver - Communication controller interface ................................................................................................................... .. 5
3.3 Bus driver - Host interface ............................................................................................................................................................. .. 6
3.4 Bus driver - Bus signal interface ................................................................................................................................................... .. 6
3.4.1 Receiver characteristics ............................................................................................................................................................... .. 6
3.4.2 Transmitter characteristics ........................................................................................................................................................ .. 8
3.5 Failure detection characteristics .................................................................................................................................................. .. 9
4 Functional description ........................................................................................................................................................................ .. 9
4.1 FlexRay bus driver in different FlexRay configurations ....................................................................................................... .. 9
4.1.1 FlexRay network topologies ....................................................................................................................................................... .. 9
4.1.2 Node configuration ...................................................................................................................................................................... 11
4.1.3 Operation modes........................................................................................................................................................................... 11
4.1.3.1 Normal and low-power operation modes ......................................................................................................................... 11
4.1.3.2 Operation mode transitions ................................................................................................................................................... 12
4.1.3.3 Operation mode transitions state diagram ....................................................................................................................... 12
4.2 E910.54 functional blocks .............................................................................................................................................................. 13
4.2.1 Block diagram ................................................................................................................................................................................. 13
4.2.2 Power supplies ............................................................................................................................................................................... 13
4.2.2.1 Voltage monitor ......................................................................................................................................................................... 13
4.2.2.2 Temperature protection .......................................................................................................................................................... 13
4.2.2.3 Power-on ....................................................................................................................................................................................... 14
4.2.3 Communication controller interface ...................................................................................................................................... 14
4.2.4 Host interface ................................................................................................................................................................................. 14
4.2.5 Bus signal interface....................................................................................................................................................................... 16
4.2.5.1 Receiver ......................................................................................................................................................................................... 16
4.2.5.2 Transmitter .................................................................................................................................................................................. 17
4.2.6 Failure Detection and Storage ................................................................................................................................................... 19
4.2.6.1 Undervoltages and Overtemperature ................................................................................................................................ 19
4.2.6.2 Interface failure detection ...................................................................................................................................................... 19
4.2.6.3 List of conditions, bus driver actions and signaling ........................................................................................................ 19
4.2.6.4 Bus failure detection methods .............................................................................................................................................. 21
5 ISO7637 pulse test implementation .............................................................................................................................................. 22
6 Package .....................................................................................................................................................................................................22
6.1 Package outline .................................................................................................................................................................................. 22
6.2 Marking ................................................................................................................................................................................................ 22
6.2.1 Top side ............................................................................................................................................................................................. 22
6.2.2 Bottom side ..................................................................................................................................................................................... 22
6.3 RoHS conformance ........................................................................................................................................................................... 23
Abbreviations ............................................................................................................................................................................................ 24
Contact .....................................................................................................................................................................................................24
ELMOS Semiconductor AG
Data sheet
QM-No.: 25DS0004.00 2010-02-03
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