AS1364-BTDT-33-1k ams, AS1364-BTDT-33-1k Datasheet - Page 12

• Manufacturer Part Number: AS1364-BTDT-33-1k
• Description: Low Dropout Controllers - LDO
• Manufacturer: ams

Specifications of AS1364-BTDT-33-1k

• Rohs: yes
• Input Voltage Max: 5.5 V
• Output Voltage: 3.3 V
• Output Current: 1 A
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TDFN-8
• Input Voltage Min: 2 V
• Minimum Operating Temperature: - 40 C

AS1364
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.3 Power Dissipation
Maximum power dissipation (PD) of the LDO is the sum of the power dissipated by the internal series MOSFET and the quiescent current
required to bias the internal voltage reference and the internal error amplifier, and is calculated as:
Internal power dissipation as a result of the bias current for the internal voltage reference and the error amplifier is calculated as:
Total LDO power dissipation is calculated as:
9.4 Junction Temperature
Under all operating conditions, the maximum junction temperature should not be allowed to exceed 125ºC (unless the data sheet specifically
allows). Limiting the maximum junction temperature requires knowledge of the heat path from junction to case (
manufacturer), and adjustment of the case to ambient heat path (
Figure 19. Package Physical Arrangements
Figure 20. Steady State Heat Flow Equivalent Circuit
www.austriamicrosystems.com
PD
PD
Power
Chip
PCB


MAX
MAX


Lead Frame


Total
Seriespass
Package
Junction
PD
T

J
°C
=
Exposed Pad

MAX
PD

=


R

MAX
Bias
I
JC
LOAD MAX


Seriespass

Package
CA

TDFN Package
=
T
Chip
C
Revision 1.8
ºC/W) by manipulation of the PCB copper area adjacent to the IC position.
°C
V
IN MAX



V
IN MAX
R



I
CS
+
Q
PD
PCB/Heatsink

Watts
–

T
V
MAX
S
°C
OUT MIN



Bias
Bond Wire
R


SA

Watts
Watts
Ambient
T
A
°C
JC
ºC/W fixed by the IC
12 - 19
(EQ 5)
(EQ 6)
(EQ 7)