74LVC125ABQ-G NXP Semiconductors, 74LVC125ABQ-G Datasheet - Page 2

• Manufacturer Part Number: 74LVC125ABQ-G
• Description: Buffers & Line Drivers QUAD BUFFR/LINE DRVR
• Manufacturer: NXP Semiconductors

Specifications of 74LVC125ABQ-G

• Product Category: Buffers & Line Drivers
• Rohs: yes
• Number Of Input Lines: 8
• Number Of Output Lines: 4
• Polarity: Non-Inverting
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 1.2 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-762-14
• High Level Output Current: - 24 mA
• Logic Family: LVC
• Logic Type: CMOS
• Low Level Output Current: 24 mA
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 40 C
• Number Of Channels Per Chip: 4
• Output Type: 3-State
• Propagation Delay Time: 2.4 ns
• Factory Pack Quantity: 3000
• Part # Aliases: 74LVC125ABQ,115

NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC125A
Product data sheet
Type number
74LVC125AD
74LVC125ADB
74LVC125APW 40 C to +125 C TSSOP14
74LVC125ABQ 40 C to +125 C DHVQFN14
Fig 1.
Logic symbol
10
12
13
2
1
5
4
9
Ordering information
1OE
2OE
3OE
4OE
1A
2A
3A
4A
Package
Temperature
range
40 C to +125 C SO14
40 C to +125 C SSOP14
mna228
1Y
2Y
3Y
4Y
11
3
6
8
Name
All information provided in this document is subject to legal disclaimers.
Fig 2.
Quad buffer/line driver with 5 V tolerant input/outputs; 3-state
Rev. 6 — 5 March 2013
IEC logic symbol
10
12
13
Description
plastic small outline package; 14 leads; body width
3.9 mm; body thickness 1.47 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 14 terminals;
body 2.5  3  0.85 mm
2
1
5
4
9
EN1
mna229
1
11
3
6
8
Fig 3.
nOE
nA
Logic diagram
74LVC125A
© NXP B.V. 2013. All rights reserved.
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1
mna227
2 of 16
nY