MCIMX251AJM4AR2 Freescale Semiconductor, MCIMX251AJM4AR2 Datasheet - Page 38
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MCIMX251AJM4AR2
Manufacturer Part Number
MCIMX251AJM4AR2
Description
Processors - Application Specialized IMX25 1.2 AUTO
Manufacturer
Freescale Semiconductor
Datasheet
1.MCIMX251AJM4AR2.pdf
(140 pages)
Specifications of MCIMX251AJM4AR2
Core
ARM926EJ-S
Processor Series
MCIMX25
Maximum Clock Frequency
400 MHz
Instruction / Data Cache Memory
16 KB
Data Ram Size
128 KB
Operating Supply Voltage
1.15 V to 1.52 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-400
Interface Type
USB
Memory Type
DDR2
Minimum Operating Temperature
- 40 C
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1
2
3
4
38
Output pad propagation delay
40%–60% input signals and crossing of output signals
Output pad propagation delay
40%–60% input signals and crossing of output signals
Output enable to output valid delay
50%–50%
Output enable to output valid delay
50%–50%
Output enable to output valid delay
50%–50%
Output enable to output valid delay
40%–60%
Output enable to output valid delay
40%–60%
Output enable to output valid delay
40%–60%
Output pad slew rate
Output pad slew rate
Output pad slew rate
Output pad dI/dt
Output pad dI/dt
Output pad dI/dt
Input pad transition times
Input pad propagation delay, 50%–50%
Input pad propagation delay, 40%–60%
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
bcs model, 1.3 V, I/O 3.6 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
Minimum condition for tps: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
Maximum condition for tdit: bcs model, 1.3 V, I/O 3.6 V, and –40 °C.
Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 3.0 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 3.6 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
3
3
3
(max. drive)
(high drive)
(standard drive)
Table 28. AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O (continued)
2
2
2
Parameter
(max. drive)
(high drive)
(standard drive)
4
i.MX25 Applications Processor for Automotive Products, Rev. 9
1
1
(high drive),
(standard drive),
1
1
1
1
1
1
(standard drive),
(standard drive),
(max. drive),
(high drive),
(max. drive),
(high drive),
4
4
Symbol
tpo
tpo
tpv
tpv
tpv
tpv
tpv
tpv
tps
tps
tps
tdit
tdit
tdit
trfi
tpi
tpi
Condition
1.0 pF
1.0 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
15 pF
35 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
Load
1.85/1.75
2.52/2.42
2.42/2.32
3.76/3.66
1.37/1.34
1.77/1.83
1.55/1.56
2.15/2.29
2.07/2.18
3.28/3.65
1.46/1.42
1.77/1.81
1.60/1.59
2.07/2.18
2.01/2.09
2.96/3.26
1.11/1.20
0.60/0.65
0.75/0.81
0.40/0.43
0.38/0.41
0.20/0.22
0.07/0.08
0.56/0.69
1.38/1.51
Rise/Fall
Min.
89
95
60
63
29
31
2.65/2.49
3.51/3.36
3.40/3.25
5.15/4.99
2.22/2.02
2.77/2.63
2.46/2.30
3.28/3.21
3.20/3.08
4.84/4.90
2.28/2.07
2.71/2.56
2.47/2.30
3.12/3.02
3.05/2.91
4.34/4.37
1.74/1.75
0.93/0.95
1.16/1.18
0.62/0.64
0.59/0.61
0.31/0.32
0.11/0.12
0.87/1.08
1.68/1.89
Typ.
202
213
135
142
67
70
Freescale Semiconductor
3.79/3.55
4.97/4.72
4.83/4.59
7.17/6.92
3.53/3.12
4.30/3.92
3.87/3.47
5.02/4.67
4.92/4.50
7.21/6.89
3.54/3.13
4.15/3.78
3.82/3.41
4.72/4.37
4.64/4.23
6.45/6.13
2.63/2.48
1.39/1.29
1.76/1.65
0.89/0.83
0.47/0.43
0.16/0.20
1.37/1.62
2.18/2.42
Rise/Fall
094/0.87
Max.
435
456
288
302
144
150
mA/ns
mA/ns
mA/ns
Units
V/ns
V/ns
V/ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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