MCIMX251AJM4AR2 Freescale Semiconductor, MCIMX251AJM4AR2 Datasheet - Page 39
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MCIMX251AJM4AR2
Manufacturer Part Number
MCIMX251AJM4AR2
Description
Processors - Application Specialized IMX25 1.2 AUTO
Manufacturer
Freescale Semiconductor
Datasheet
1.MCIMX251AJM4AR2.pdf
(140 pages)
Specifications of MCIMX251AJM4AR2
Core
ARM926EJ-S
Processor Series
MCIMX25
Maximum Clock Frequency
400 MHz
Instruction / Data Cache Memory
16 KB
Data Ram Size
128 KB
Operating Supply Voltage
1.15 V to 1.52 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-400
Interface Type
USB
Memory Type
DDR2
Minimum Operating Temperature
- 40 C
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1
2
3
4
3.6.3.3
Table 29
Table 30
Freescale Semiconductor
Duty cycle
Clock frequency
Output pad transition times
Output pad propagation delay, 50%–50%
Output pad propagation delay, 40%–60%
Output enable to output valid delay, 50%–50%
Output enable to output valid delay, 40%–60%
Output pad slew rate
Output pad dI/dt
Input pad transition times
Input pad propagation delay, 50%–50%
Input pad propagation delay, 40%–60%
Duty cycle
Clock frequency
Output pad transition times
Output pad propagation delay
signals and crossing of output signals
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1. V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
model, 1.3 V, I/O 1.9 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
Minimum condition for tps: wcs model, 1.1 V, I/O 1.7 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
Maximum condition for tdit: bcs model, 1.3 V, I/O 1.9 V, and –40 °C.
Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.7 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 1.9 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
shows AC parameters for DDR2 I/O.
shows AC parameters for DDR2 pbijtov18_33_ddr_clk I/O.
DDR_TYPE = 10 Max Setting I/O AC Parameters and Requirements
3
Parameter
Parameter
2
4
1
1
Table 30. AC Parameters for DDR2 pbijtov18_33_ddr_clk I/O
i.MX25 Applications Processor for Automotive Products, Rev. 9
1
, 50%–50% input
4
4
Table 29. AC Parameters for DDR2 I/O
1
1
1
1
Symbol
Symbol
Fduty
Fduty
tpo
tpo
tpv
tpv
tps
tdit
tpo
tpr
trfi
tpi
tpi
tpr
f
f
Condition
Condition
1.0 pF
1.0 pF
1.0 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
Load
Load
—
—
—
—
0.53/0.52
1.01/0.98
Rise/Fall
0.53/0.52
1.01/0.98
0.93/1.25
1.26/1.54
1.01/1.17
1.27/1.53
1.30/1.19
1.62/1.54
1.39/1.27
1.64/1.55
0.86/0.98
0.07/0.08
0.83/0.99
1.65/1.81
Rise/Fall
1.3/1.21
1.59/1.5
0.46/054
Min.
Min.
40
—
40
65
70
—
0.80/0.72
1.49/1.34
1.97/1.84
2.37/2.24
0.80/0.72
1.49/1.34
1.56/1.70
2.07/2.19
1.60/1.75
2.00/2.14
2.17/1.81
2.56/2.29
2.13/1.86
2.62/2.23
0.72/0.81
0.10/0.12
1.23/1.49
2.05/2.31
1.35/1.5
Typ.
Typ.
157
167
50
—
50
—
1.19/1.04
2.21/1.90
2.91/2.71
3.48/3.28
Rise/Fall
1.19/1.04
2.21/1.90
2.52/2.53
3.29/3.24
2.49/2.52
3.11/3.10
3.35/2.84
3.35/2.54
3.38/2.83
4.14/2.38
2.15/2.19
1.12/1.16
0.17/0.20
1.79/2.04
2.60/2.84
Rise/Fall
Max.
Max.
133
133
373
396
60
60
mA/ns
Units
Units
MHz
V/ns
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
%
%
39
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