MCIMX255AJM4AR2 Freescale Semiconductor, MCIMX255AJM4AR2 Datasheet - Page 124

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MCIMX255AJM4AR2

Manufacturer Part Number
MCIMX255AJM4AR2
Description
Processors - Application Specialized IMX25 1.2 AUTO
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MCIMX255AJM4AR2

Core
ARM926EJ-S
Processor Series
MCIMX25
Maximum Clock Frequency
400 MHz
Instruction / Data Cache Memory
16 KB
Data Ram Size
128 KB
Operating Supply Voltage
1.15 V to 1.52 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-400
Interface Type
USB
Memory Type
DDR2
Minimum Operating Temperature
- 40 C
Figure 97
parameters (USB15–USB17) shown in the figure.
4
4.1
Figure 98
124
US15
US16
US17
ID
Package Information and Contact Assignment
All dimensions in millimeters.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Maximum solder bump diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
Parallelism measurement shall exclude any effect of mark on top surface of package.
400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch
shows the USB parallel mode transmit/receive waveform.
USB_Dir/Nxt
shows the 17 17 mm i.MX25 production package. The following notes apply to
USB_Data
Setup time (Dir&Nxt in, Data in)
Hold time (Dir&Nxt in, Data in)
Output delay time (Stp out, Data out
USB_Clk
USB_Stp
Figure 97. USB Parallel Mode Transmit/Receive Waveform
Parameter
i.MX25 Applications Processor for Automotive Products, Rev. 9
US15
Table 99. USB Timing Specification in Parallel Mode
US15
US16
US16
Min.
6.0
0.0
US17
Max.
9.0
Table 99
Unit
US17
ns
ns
ns
describes the timing
Conditions/Reference Signal
Freescale Semiconductor
10 pF
10 pF
10 pF
Figure
98:

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