IS62WV1288BLL-55HLI ISSI, Integrated Silicon Solution Inc, IS62WV1288BLL-55HLI Datasheet - Page 14
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IS62WV1288BLL-55HLI
Manufacturer Part Number
IS62WV1288BLL-55HLI
Description
IC SRAM 1MBIT 55NS 32TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
Asynchronousr
Datasheet
1.IS62WV1288BLL-55HLI.pdf
(15 pages)
Specifications of IS62WV1288BLL-55HLI
Memory Size
1M (128K x 8)
Package / Case
32-TSOP
Interface
Parallel
Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Speed
55ns
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Access Time
55 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
8 mA
Organization
128 K x 8
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Ports
1
Operating Supply Voltage
2.5 V to 3.6 V
Density
1Mb
Access Time (max)
55ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3.3V
Address Bus
17b
Package Type
STSOP-I
Operating Temp Range
-40C to 85C
Supply Current
8mA
Operating Supply Voltage (min)
2.5V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Word Size
8b
Number Of Words
128K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
706-1046
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS62WV1288BLL-55HLI
Manufacturer:
ISSI
Quantity:
80
Company:
Part Number:
IS62WV1288BLL-55HLI
Manufacturer:
ISSI
Quantity:
1 000
Company:
Part Number:
IS62WV1288BLL-55HLI
Manufacturer:
PHILIPS
Quantity:
10 837
Part Number:
IS62WV1288BLL-55HLI
Manufacturer:
ISSI
Quantity:
20 000
PACKAGING INFORMATION
Mini Ball Grid Array
Package Code: B (36-pin)
mBGA - 6mm x 8mm
Sym.
N0.
Leads
A
A1
A2
D
D1
E
E1
e
b
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. E
01/15/03
Min. Typ. Max.
0.60
7.90 8.00 8.10
5.90 6.00 6.10
0.30 0.35 0.40
0.24
MILLIMETERS
—
D
A2
5.25BSC
3.75BSC
0.75BSC
G
A
B
C
D
E
F
H
—
—
—
36
1.20
0.30
—
1
SEATING PLANE
Top View
2
0.009
0.024
0.311 0.315 0.319
0.232 0.236 0.240
0.012 0.014 0.016
Min. Typ. Max.
3
—
E
0.148BSC
0.030BSC
0.207BSC
INCHES
4
36
—
—
—
5 6
0.047
0.012
—
A1
1-800-379-4774
A
D1
mBGA - 8mm x 10mm
Sym.
N0.
Leads
A
A1
A2
D
D1
E
E1
e
b
e
Min. Typ. Max.
0.60
9.90 10.00 10.10
7.90 8.00
0.30 0.35 0.40
Notes:
1. Controlling dimensions are in millimeters.
0.24
—
MILLIMETER
3.75BSC
0.75BSC
5.25BSC
6
—
—
—
36
Bottom View
5
1.20
0.30
8.10
4
—
E1
3
2
φ b (36x)
0.009
0.024
0.390 0.394 0.398
0.311 0.315 0.319
0.012 0.014 0.016
Min. Typ. Max.
e
—
1
INCHES
0.148BSC
0.030BSC
.207BSC
36
—
—
—
G
A
B
C
D
E
F
H
0.047
0.012
—