M93S46-WMN6TP STMicroelectronics, M93S46-WMN6TP Datasheet - Page 3

• Manufacturer Part Number: M93S46-WMN6TP
• Description: IC EEPROM 1KBIT 2MHZ 8SOIC
• Manufacturer: STMicroelectronics

Specifications of M93S46-WMN6TP

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (64 x 16)
• Speed: 2MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 64 K x 16
• Interface Type: Microwire
• Maximum Clock Frequency: 2 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V, 5 V
• Density: 1Kb
• Frequency (max): 2MHz
• Write Protection: Yes
• Data Retention: 40Year
• Operating Supply Voltage (typ): 3.3/5V
• Package Type: SOIC N
• Operating Temp Range: -40C to 85C
• Supply Current: 2mA
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8666-2; M93S46-WMN6TP

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 9. AC Testing Input Output Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 10. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 11. DC Characteristics (M93Sx6, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. DC Characteristics (M93Sx6, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 13. DC Characteristics (M93Sx6-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 14. DC Characteristics (M93Sx6-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 15. DC Characteristics (M93Sx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 16. AC Characteristics (M93Sx6, Device Grade 6 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 17. AC Characteristics (M93Sx6-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 18. AC Characteristics (M93Sx6-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 19. AC Characteristics (M93Sx6-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 10.Synchronous Timing (Start and Op-Code Input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 11.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 12.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 13.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 28
Table 20. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 28
Figure 14.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 29
Table 21. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
29
Figure 15.TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline
30
Table 22. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data
30
Figure 16.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 31
Table 23. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 31
Table 24. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 25. How to Identify Current and New Products by the Process Identification Letter . . . . . . . 32
Table 26. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
M93S66, M93S56, M93S46
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