W25Q80BVDAIG Winbond Electronics, W25Q80BVDAIG Datasheet - Page 69
W25Q80BVDAIG
Manufacturer Part Number
W25Q80BVDAIG
Description
SPI FLASH 8MBIT 8-DIP
Manufacturer
Winbond Electronics
Datasheet
1.W25Q80BVSSIG.pdf
(75 pages)
Specifications of W25Q80BVDAIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- Current page: 69 of 75
- Download datasheet (2Mb)
11.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SYMBOL
A1
A2
D1
E1
e
A
C
D
E
H
b
L
θ
y
(2)
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
MILLIMETERS
1.27 BSC.
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
- 69 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
Min
---
0°
Publication Release Date: October 06, 2010
0.050 BSC.
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
---
---
Max
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
W25Q80BV
GAUGE PLANE
GAUGE PLANE
Revision D
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