CY7C1474BV25-167BGI Cypress Semiconductor Corp, CY7C1474BV25-167BGI Datasheet - Page 21

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CY7C1474BV25-167BGI

Manufacturer Part Number
CY7C1474BV25-167BGI
Description
IC SRAM 72MBIT 167MHZ 209FBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1474BV25-167BGI

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (1M x 72)
Speed
167MHz
Interface
Parallel
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
-40°C ~ 85°C
Package / Case
209-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1474BV25-167BGI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1474BV25-167BGIT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Switching Characteristics
Over the Operating Range. Timing reference is 1.25V when V
Waveforms” on page 20
Notes
Document #: 001-15032 Rev. *D
15. This part has a voltage regulator internally; t
16. t
17. At any supplied voltage and temperature, t
18. This parameter is sampled and not 100% tested.
t
Clock
t
F
t
t
Output Times
t
t
t
t
t
t
t
Setup Times
t
t
t
t
t
t
Hold Times
t
t
t
t
t
t
Power
CYC
CH
CL
CO
OEV
DOH
CHZ
CLZ
EOHZ
EOLZ
AS
DS
CENS
WES
ALS
CES
AH
DH
CENH
WEH
ALH
CEH
MAX
Parameter
steady-state voltage.
bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve
High-Z before Low-Z under the same system conditions.
CHZ
[15]
, t
CLZ
, t
EOLZ
, and t
V
Clock Cycle Time
Maximum Operating Frequency
Clock HIGH
Clock LOW
Data Output Valid After CLK Rise
OE LOW to Output Valid
Data Output Hold After CLK Rise
Clock to High-Z
Clock to Low-Z
OE HIGH to Output High-Z
OE LOW to Output Low-Z
Address Setup Before CLK Rise
Data Input Setup Before CLK Rise
CEN Setup Before CLK Rise
WE, BW
ADV/LD Setup Before CLK Rise
Chip Select Setup
Address Hold After CLK Rise
Data Input Hold After CLK Rise
CEN Hold After CLK Rise
WE, BW
ADV/LD Hold after CLK Rise
Chip Select Hold After CLK Rise
CC
EOHZ
(typical) to the First Access Read or Write
unless otherwise noted.
are specified with AC test conditions shown in (b) of
x
x
Setup Before CLK Rise
Hold After CLK Rise
[16, 17, 18]
[16, 17, 18]
Description
EOHZ
power
is less than t
is the time power is supplied above V
[16, 17, 18]
[16, 17, 18]
EOLZ
and t
CHZ
is less than t
DDQ
“AC Test Loads and Waveforms” on page
= 2.5V. Test conditions shown in (a) of
Min
4.0
2.0
2.0
1.3
1.3
1.4
1.4
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
0.4
0.4
DD
CLZ
1
0
minimum initially, before a read or write operation can be initiated.
–250
to eliminate bus contention between SRAMs when sharing the same data
CY7C1472BV25, CY7C1474BV25
Max
250
3.0
3.0
3.0
3.0
Min
5.0
2.0
2.0
1.3
1.3
1.4
1.4
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
0.4
0.4
1
0
–200
Max
200
3.0
3.0
3.0
3.0
20. Transition is measured ±200 mV from
CY7C1470BV25
Min
6.0
2.2
2.2
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
0.5
0.5
1
0
“AC Test Loads and
–167
Max
167
3.4
3.4
3.4
3.4
Page 21 of 29
MHz
Unit
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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