IS62WV5128BLL-55BLI ISSI, Integrated Silicon Solution Inc, IS62WV5128BLL-55BLI Datasheet - Page 16

• Manufacturer Part Number: IS62WV5128BLL-55BLI
• Description: IC SRAM 4MBIT 55NS 36MBGA
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS62WV5128BLL-55BLI

• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Memory Size: 4M (512K x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 36-MBGA
• Density: 4Mb
• Access Time (max): 55ns
• Sync/async: Asynchronous
• Architecture: Not Required
• Clock Freq (max): Not RequiredMHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 19b
• Package Type: Mini BGA
• Operating Temp Range: -40C to 85C
• Number Of Ports: 1
• Supply Current: 45mA
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 36
• Word Size: 8b
• Number Of Words: 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGING INFORMATION
Plastic STSOP - 32 pins
Package Code: H (Type I)
Integrated Silicon Solution, Inc.
PK13197H32 Rev. B 04/21/03
1
Ref. Std.
Symbol Min
D1
N
A1
A2
A
C
D
E
S
b
e
L
α
13.20 13.60
11.70 11.90
Millimeters
0.05
0.95
0.17
0.14
7.90
0.30
—
Plastic STSOP (H - Type I)
0.28 Typ.
0°
0.50 BSC
Max
1.25
1.05
0.23
0.16
8.10
0.70
—
5°
32
0.0055
0.002
0.037
0.007
0.520
0.461
0.311
0.012
Min
—
0°
D1
0.020 BSC
0.011 Typ.
D
Inches
0.0063
0.049
0.041
0.009
0.535
0.469
0.319
0.028
Max
—
5°
L
Notes:
1. Controlling dimension: millimeters, unless otherwise
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
4. Formed leads shall be planar with respect to one another
N
specified.
sions and should be measured from the bottom of the package.
within 0.004 inches at the seating plane.
α
E
SEATING PLANE
A2
C
A
S
A1
b
e