IS41LV16100B-60KL ISSI, Integrated Silicon Solution Inc, IS41LV16100B-60KL Datasheet - Page 20
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IS41LV16100B-60KL
Manufacturer Part Number
IS41LV16100B-60KL
Description
IC DRAM 16MBIT 60NS 42SOJ
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet
1.IS41LV16100B-50TL-TR.pdf
(22 pages)
Specifications of IS41LV16100B-60KL
Format - Memory
RAM
Memory Type
DRAM - EDO
Memory Size
16M (1M x 16)
Speed
60ns
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
42-SOJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS41LV16100B-60KLI
Manufacturer:
ISSI
Quantity:
1 000
400-mil Plastic SOJ
Package Code: K
PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
10/29/03
No. Leads (N)
Symbol
A1
A2
E1
E2
N
A
B
C
D
E
b
e
1
Min
Millimeters
18.29 18.54
11.05 11.30
10.03 10.29
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
e
Max
3.75
0.51
0.81
0.33
—
—
28
D
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.720 0.730
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
Max
—
—
B
N/2
N/2+1
b
20.82 21.08
10.03 10.29
11.05 11.30
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
A
E1
A1
Max
1-800-379-4774
—
—
3.75
0.51
0.81
0.33
32
E
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.820 0.830
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
SEATING PLANE
Max
—
—
23.37 23.62
11.05 11.30
10.03 10.29
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
E2
Notes:
1. Controlling dimension:
2. BSC = Basic lead spacing
3. Dimensions D and E1 do not
4. Reference document: JEDEC
MS-027.
millimeters.
between centers.
the bottom of the package.
and should be measured from
include mold flash protrusions
Max
3.75
0.51
0.81
0.33
—
—
ISSI
36
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.920 0.930
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
Inches
C
Max
A2
—
—
®