IS43R16160B-6TLI ISSI, Integrated Silicon Solution Inc, IS43R16160B-6TLI Datasheet - Page 39

• Manufacturer Part Number: IS43R16160B-6TLI
• Description: IC DDR SDRAM 256MBIT 66TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: SDRAMr

Specifications of IS43R16160B-6TLI

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 2.7 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 66-TSOPII
• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 700ps
• Maximum Clock Rate: 167MHz
• Operating Supply Voltage (typ): 2.5V
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Supply Current: 250mA
• Pin Count: 66
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Plastic TSOP 66-pin
Package Code: T (Type II)
IS43R83200B
IS43R16160B, IC43R16160B
Integrated Silicon Solution, Inc.
Rev. B
10/31/08
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
A
C
D
E
b
e
L
e
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.03 10.29
11.56 11.96
—
—
—
0.71 REF
0.05
0.24
0.12
0.40
0°
0.65 BSC
—
—
Max
1.20
0.15
0.40
0.21
0.60
8°
66
D
—
—
—
Min
0.002 0.006
0.009 0.016
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.026 BSC
0.016 0.024
0.028 REF
0°
Inches
—
—
Max
0.047
8°
N/2+1
b
N/2
E1
A
A1
E
SEATING PLANE
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
.
should be
C
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