IS42S32800D-6BLI ISSI, Integrated Silicon Solution Inc, IS42S32800D-6BLI Datasheet - Page 62

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IS42S32800D-6BLI

Manufacturer Part Number
IS42S32800D-6BLI
Description
IC SDRAM 256MBIT 166MHZ 90BGA
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheets

Specifications of IS42S32800D-6BLI

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (8Mx32)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
90-BGA
Organization
8Mx32
Density
256Mb
Address Bus
13b
Access Time (max)
6.5/5.4ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS42S32800D-6BLI
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
Part Number:
IS42S32800D-6BLI
Manufacturer:
ISSI
Quantity:
20 000
Company:
Part Number:
IS42S32800D-6BLI
Quantity:
442
Part Number:
IS42S32800D-6BLI-TR
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc.
Rev. D
03/13/07
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
C
D
A
b
E
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
Millimeters
0.71 REF
0.05
0.30
0.12
0.80 BSC
0.40
Max
1.20
0.15
0.45
0.21
0.60
54
D
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
Inches
Max
0.047
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
A
C
D
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.03 10.29
11.56 11.96
0.05
0.95
0.17
0.12
0.40
0.80 REF
0.50 BSC
0.61 REF
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
.
86
Min
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.395 0.405
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
Inches
0.024 BSC
Max
0.047
should be
C
1

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