M25P05-AVMN6P NUMONYX, M25P05-AVMN6P Datasheet - Page 32

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M25P05-AVMN6P

Manufacturer Part Number
M25P05-AVMN6P
Description
IC FLASH 512KBIT 50MHZ 8SOIC
Manufacturer
NUMONYX
Series
Forté™r
Datasheet

Specifications of M25P05-AVMN6P

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
512K (64K x 8)
Speed
50MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Clock Frequency
50MHz
Supply Voltage Range
2.3V To 3.6V
Memory Case Style
SOIC
No. Of Pins
8
Base Number
25
Frequency
50MHz
Ic Generic Number
25P05
Memory Configuration
64K X 8
Interface Type
Serial, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Instructions
6.11
32/52
Deep power-down (DP)
Executing the deep power-down (DP) instruction is the only way to put the device in the
lowest consumption mode (the deep power-down mode). It can also be used as a software
protection mechanism, while the device is not in active use, as in this mode, the device
ignores all write, program and erase instructions.
Driving Chip Select (S) High deselects the device, and puts the device in standby mode (if
there is no internal cycle currently in progress). But this mode is not the deep power-down
mode. The deep power-down mode can only be entered by executing the deep power-down
(DP) instruction, subsequently reducing the standby current (from I
in
To take the device out of deep power-down mode, the release from deep power-down and
read electronic signature (RES) instruction must be issued. No other instruction must be
issued while the device is in deep power-down mode.
The release from deep power-down and read electronic signature (RES) instruction, and the
read identification (RDID) instruction also allow the electronic signature of the device to be
output on Serial Data output (Q).
The deep power-down mode automatically stops at power-down, and the device always
powers-up in the standby mode.
The deep power-down (DP) instruction is entered by driving Chip Select (S) Low, followed
by the instruction code on Serial Data input (D). Chip Select (S) must be driven Low for the
entire duration of the sequence.
The instruction sequence is shown in
Chip Select (S) must be driven High after the eighth bit of the instruction code has been
latched in, otherwise the deep power-down (DP) instruction is not executed. As soon as
Chip Select (S) is driven High, it requires a delay of t
to I
Any deep power-down (DP) instruction, while an erase, program or write cycle is in
progress, is rejected without having any effects on the cycle that is in progress.
Figure 17. Deep power-down (DP) instruction sequence
S
C
D
Table
CC2
and the deep power-down mode is entered.
13).
0
1
2
Instruction
3
4
5
6
Figure 17.
7
DP
t
Standby mode
DP
before the supply current is reduced
CC1
Deep power-down mode
to I
CC2
, as specified
M25P05-A
AI03753D

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