MT28F320J3BS-11 MET TR Micron Technology Inc, MT28F320J3BS-11 MET TR Datasheet - Page 53
![IC FLASH 32MBIT 110NS 64FBGA](/photos/7/30/73002/557-64-fbga_sml.jpg)
MT28F320J3BS-11 MET TR
Manufacturer Part Number
MT28F320J3BS-11 MET TR
Description
IC FLASH 32MBIT 110NS 64FBGA
Manufacturer
Micron Technology Inc
Datasheet
1.MT28F128J3FS-12_ET_TR.pdf
(55 pages)
Specifications of MT28F320J3BS-11 MET TR
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4Mx8, 2Mx16)
Speed
110ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
64-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NOTE:
09005aef80b5a323
MT28F640J3.fm – Rev. N 3/05 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.40
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
All dimensions in millimeters.
SEATING PLANE
64X ∅0.45
7.00
0.10 C
BALL A8
3.50 ±0.05
0.850 ±0.075
Micron, the M logo, the Micron logo, and Q-Flash are trademarks of Micron Technology, Inc.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
C
3.50 ±0.05
1.00 TYP
All other trademarks are the property of their respective owners.
10.00 ±0.10
7.00
C L
5.00 ±0.05
Figure 23: 64-Ball FBGA
1.00 TYP
C L
6.50 ±0.05
BALL A1
BALL A1 ID
13.00 ±0.10
53
®
Micron Technology, Inc., reserves the right to change products or specifications without notice..
1.20 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø 0.33 NON SOLDER MASK DEFINED
128Mb, 64Mb, 32Mb
Q-FLASH MEMORY
BALL A1 ID
©2000 Micron Technology, Inc