MT48H8M16LFB4-8 IT:J TR Micron Technology Inc, MT48H8M16LFB4-8 IT:J TR Datasheet - Page 12

• Manufacturer Part Number: MT48H8M16LFB4-8 IT:J TR
• Description: IC SDRAM 128MBIT 125MHZ 54VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M16LFB4-8 IT:J TR

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 128M (8Mx16)
• Speed: 125MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 54-VFBGA
• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 14b
• Access Time (max): 8/6ns
• Maximum Clock Rate: 125MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 50mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1236-2

Package Dimensions
Figure 6:
PDF: 09005aef832ff1ea/Source: 09005aef832ff1ac
128mb_mobile_sdram_y35m__2.fm - Rev. E 4/09 EN
Dimensions apply
to solder balls
post-reflow. Pre-
reflow balls are
Ø0.42 on Ø0.4
SMD ball pads.
Exposed plated
features in all
corners are floating
nonbiased metal.
Seating
plane
54X Ø0.45
6.4
0.1 A
0.8 TYP
54-Ball VFBGA (8mm x 8mm)
3.2
Notes:
A
9
1. All dimensions are in millimeters.
8
3.2
7
8 ±0.1
6.4
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
0.8 TYP
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
Ball A1 ID
4 ±0.05
12
0.65 ±0.05
8 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID