W25P16VSSIG Winbond Electronics, W25P16VSSIG Datasheet - Page 34

• Manufacturer Part Number: W25P16VSSIG
• Description: IC FLASH 16MBIT 50MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25P16VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 50MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.4 DC Electrical Characteristics (Preliminary)
Notes:
1 .See Preliminary Designation.
2. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V
3. Checker Board Pattern.
Input Capacitance
Output Capacitance
Input Leakage
I/O Leakage
Standby Current
Power-down Current
Current Read Data
1MHz
Current Read Data
20MHz
Current Read Data
33MHz
Current Page
Program
Current Write Status
Register
Current Sector Erase I
Current Chip Erase
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
PARAMETER
(3)
(3)
(3)
C
Cout
I
I
I
I
I
I
I
I
V
V
V
V
SYMBOL
LI
LO
CC
CC
CC
CC
CC
CC
CC
IL
IH
OL
OH
IN
1
2
3
4
5
6
7
(2)
(2)
V
V
/CS = VCC,
VIN = GND or VCC
/CS = VCC,
VIN = GND or VCC
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
/CS = VCC
/CS = VCC
/CS = VCC
/CS = VCC
I
I
OL
OH
IN
OUT
= 1.6 mA
= 0V
= –100 µA
CONDITIONS
= 0V
(2)
(2)
- 34 -
(1)
W25P80 AND W25P16
VCC –0.2
VCC x0.7
–0.5
MIN
SPEC
TYP
25
<1
23
10
23
23
4
8
9
VCC +0.4
VCC x0.3
MAX
0.4
±2
±2
50
12
15
27
15
27
27
6
8
5
8
UNIT
mA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
pf
pf
V
V
V
V