W25P16VSSIG Winbond Electronics, W25P16VSSIG Datasheet - Page 40

• Manufacturer Part Number: W25P16VSSIG
• Description: IC FLASH 16MBIT 50MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25P16VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 50MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.2 16-Pin SOIC 300-mil (Winbond Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
E1
D
e
A1
A
C
E
b
L
θ
y
(2)
(3)
(3)
10.08
10.01
2.36
0.10
0.33
0.18
7.39
0.39
MIN
MILLIMETERS
---
0
o
1.27 BSC
10.49
10.64
0.076
- 40 -
MAX
2.64
0.30
0.51
0.28
7.59
1.27
8
o
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
W25P80 AND W25P16
MIN
---
0
0.050 BSC
o
INCHES
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
0.003
MAX
8
o