LP5520TL/NOPB National Semiconductor, LP5520TL/NOPB Datasheet - Page 4

IC LED DRIVER RGB 25-USMD

LP5520TL/NOPB

Manufacturer Part Number
LP5520TL/NOPB
Description
IC LED DRIVER RGB 25-USMD
Manufacturer
National Semiconductor
Series
PowerWise®r
Type
RGB LED Driverr
Datasheet

Specifications of LP5520TL/NOPB

Constant Current
Yes
Topology
PWM, Step-Up (Boost)
Number Of Outputs
3
Internal Driver
Yes
Type - Primary
Backlight, Light Management Unit (LMU)
Type - Secondary
RGB, White LED
Frequency
1.22kHz, 19.52kHz
Voltage - Supply
2.9 V ~ 5.5 V
Voltage - Output
5 V ~ 20 V
Mounting Type
Surface Mount
Package / Case
25-MicroSMD
Operating Temperature
-30°C ~ 85°C
Current - Output / Channel
60mA
Internal Switch(s)
Yes
Efficiency
87%
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LP5520TLTR
www.national.com
Symbol
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
Limits in standard typeface are for T
< T
µF/ 25V, C
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pins.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
T
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : MicroSMD Wafer Level Chip
Scale Package
Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 7: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 8: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed but do represent the most likely norm.
Note 9: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
I
J
V (SW, FB, ROUT, GOUT, BOUT)
V
Voltage on Logic Pins
Continuous Power Dissipation
(Note 3)
Junction Temperature (T
Storage Temperature Range
Maximum Lead Temperature
(Soldering) (Note 4)
ESD Rating (Note 5)
V
VDDIO
=140°C (typ.).
I
I
VDD
LDO
DDA
LDO
J
< 85°C). Unless otherwise noted, specifications apply to the LP5520 Block Diagram with: C
, V
DDD
IN
Standby supply current
(V
No-boost supply current
(V
No-load supply current
(V
V
Internal LDO output voltage
Internal LDO output current
= 10 µF / 6.3V, L1 = 4.7 µH (Note 9).
, V
DDIO
DDA
DDA
DDA
DDIO
A-MAX
Standby Supply current
+ V
+ V
+ V
, V
DDD
DDD
DDD
= T
LDO
J-MAX-OP
)
)
)
Parameter
J-MAX
– (θ
)
JA
A-MAX
J
× P
D-MAX
= 25°C. Limits in boldface type apply over the operating ambient temperature range (-30°C
D-MAX
) is dependent on the maximum operating junction temperature (T
-0.3V to V
), and the junction-to ambient thermal resistance of the part/package in the application (θ
Internally Limited
).
-65°C to 150°C
(Notes 2, 8)
with 6.0V max
-0.3V to 6.0V
-0.3V to 22V
(Notes 1, 2)
DDIO
NSTBY = L, V
NSTBY = L , V
NSTBY = H,
EN_BOOST = L
NSTBY = H, EN_BOOST = H
AUTOLOAD = L
NSTBY = L
V
Current to external load
125°C
IN
0.3V
2.9V
4
DDIO
DDIO
Operating Ratings
Thermal Properties
Condition
Human Body Model:
Machine Model:
V (SW, FB, MAIN, SUB)
V
V
Recommended Load Current
(ROUT, GOUT, BOUT)
Junction Temperature (T
Ambient Temperature (T
(Note 6)
Junction-to-Ambient Thermal
Resistance(θ
(Note 7)
DDA,DDD
DDIO
= 0V
1.65V
JA
), TLA25 Package
J-MAX-OP
A
J
) Range
) Range
VDDA/D
2.77
Min
J
=160°C (typ.) and disengages at
= 125°C), the maximum power
(Notes 1, 2)
= 100 nF, C
0 mA to 60 mA /driver
2.80
Typ
1.7
0.9
1.4
1
-30°C to 125°C
JA
1.65V to V
-30°C to 85°C
60 - 100°C/W
), as given by the
OUT
Max
2.84
2.9 to 5.5V
7
1
1
0 to 21V
= 2 x 4.7
200V
2 kV
Units
DDA
mA
mA
mA
µA
µA
µA
V

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