ISL6208CBZ Intersil, ISL6208CBZ Datasheet - Page 3

• Manufacturer Part Number: ISL6208CBZ
• Description: IC MOSFET DRVR SYNC BUCK 8-SOIC
• Manufacturer: Intersil

Specifications of ISL6208CBZ

• Configuration: High and Low Side, Synchronous
• Input Type: PWM
• Delay Time: 20ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 33V
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -10°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ti
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
BOOT Voltage (V
BOOT To PHASE Voltage (V
PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
UGATE Voltage . . . . . . . . . . . . . . . . V
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-10°C to +100°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
Electrical Specifications
V
Bias Supply Current
POR
V
V
Hysteresis
BOOTSTRAP DIODE
Forward Voltage
PWM INPUT
Input Current
PWM Three-State Rising Threshold
PWM Three-State Falling Threshold
Three-State Shutdown Hold-off Time
FCCM INPUT
FCCM LOW Threshold
FCCM HIGH Threshold
SWITCHING TIME
UGATE Rise Time (Note 5)
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2. θ
3. θ
4. For θ
CC
CC
CC
Tech Brief TB379.
JA
JA
SUPPLY CURRENT
Rising
Falling
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V
PARAMETER
FCCM
V
BOOT-GND
PHASE
, V
PWM
- 5V (<20ns Pulse Width, 10µJ) to V
). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT-PHASE
). . . . . . . . . . . . . -0.3V to VCC + 0.3V
GND - 8V (<20ns Pulse Width, 10µJ)
3
Recommended Operating Conditions, Unless Otherwise Noted. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are
not production tested.
PHASE
) . . . . . . -0.3V to 7V (DC)
- 0.3V (DC) to V
-0.3V to 9V (<10ns)
SYMBOL
t
TSSHD
I
I
PWM
VCC
t
V
RU
F
PWM pin floating, V
V
V
V
V
V
V
V
BOOT
BOOT
VCC
PWM
PWM
VCC
VCC
VCC
VCC
ISL6208
= 5V, forward bias current = 2mA
= 5V
= 5V
= 5V, temperature = +25°C
= 5V, 3nF load
= 5V
= 0V
TEST CONDITIONS
Thermal Information
Thermal Resistance (Typical)
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
SOIC Package (Note 2) . . . . . . . . . . . .
QFN Package (Notes 3, 4). . . . . . . . . .
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
FCCM
= 5V
2.40
0.50
0.70
0.50
MIN
100
3.5
-
-
-
-
-
-
-
TYP
3.40
2.90
0.55
-250
1.00
500
250
175
3.8
8.0
80
-
-
θ
JA
110
(°C/W)
80
MAX
3.90
0.65
1.30
250
4.1
2.0
-
-
-
-
-
-
-
August 7, 2008
θ
JC
UNITS
N/A
FN9115.3
(°C/W)
15
mV
µA
µA
µA
ns
ns
V
V
V
V
V
V
V