VND830SP STMicroelectronics, VND830SP Datasheet
VND830SP
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VND830SP Summary of contents
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... I V OUT CC (1) 6A 36V Description The VND830SP is a monolithic device designed in| STMicroelectronics™ VIPower™ M0-3 Technology. The VND830SP is intended for driving any type of multiple load with one side connected to ground. The active V device against low energy spikes (see ISO7637 transient compatibility table). Active current ...
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... PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 ECOPACK 5.2 PowerSO-10 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Solution 1: a resistor in the ground line (RGND only Solution 2: a diode ( the ground line . . . . . . . . . . . . . . . . . . . . 17 GND ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 7380 Rev 4 = 13.5V VND830SP ...
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... VND830SP List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island Table 5. Power output Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 CC Table 8. Switching (V = 13V 25° Table 9. Logic inputs Table 10. ...
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... Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 30. Thermal fitting model of a double channel HSD in PowerSO- Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 32. PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 33. PowerSO-10 tube shipment (no suffix Figure 34. PowerSO-10 tape and reel shipment (suffix “TR” 4/ case Doc ID 7380 Rev 4 VND830SP ...
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... VND830SP 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) GROUND INPUT 1 STATUS 1 STATUS 2 INPUT 2 Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE ...
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... MAX (L = 1.8 mH Power dissipation (per island tot T Junction operating temperature j T Case operating temperature c T Storage temperature stg 6/27 Parameter = 13 150 ° bat jstart = 25 °C lead Doc ID 7380 Rev 4 VND830SP Value Unit 0 200 mA Internally limited +/- 10 mA +/- 10 mA 4000 V 4000 V 5000 V 5000 V ...
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... VND830SP 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-lead thj-lead R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR-4 board with 0 all V pins. Horizontal mounting and no artificial air flow When mounted on a standard single-sided FR-4 board with 6 cm all V pins ...
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... Min. Typ. Max. Unit 5 > ° 3 Min. Typ. 150 175 135 7 15 TSD 6 9 < Min. Typ. = 150 °C — — j VND830SP 120 m 40 µA 25 µ µA 0 µA 5 µA 3 µA Max. Unit 200 °C °C °C 20 µ Max. Unit 0.6 V ...
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... VND830SP Table 8. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT (off) Table 9. Logic inputs Symbol V Input low level IL I Low level input current IL V Input high level IH I High level input current ...
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... Electrical specifications Figure 4. Status timings OPEN LOAD STATUS TIMING (with external pull-up) V INn V STATn t DOL(off) Figure 5. Switching characteristics 10/27 I < > V OUT OL OUT OL t DOL(on) Doc ID 7380 Rev 4 VND830SP OVER TEMP STATUS TIMING T > TSD V INn V STATn t t SDL SDL ...
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... VND830SP Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Table 13. Electrical transient requirements ISO T/R 7637/1 Test pulse 26.5V 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device ...
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... STATUS n INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS INPUT n LOAD CURRENT STATUS n 12/27 NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN LOAD with external pull- OPEN LOAD without external pull-up n OVERTEMPERATURE T TSD Doc ID 7380 Rev 4 VND830SP OV > V OUT OL ...
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... VND830SP 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc=36V Vin=Vout=0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - 100 Tc (°C) Figure 9. Input clamp voltage Vicl (V) 8 7.8 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 ...
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... Figure 18. Input low level case Vil (V) 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 100 125 150 175 -50 Doc ID 7380 Rev 4 Tc=150°C Tc=25°C Tc= - 40°C Iout= Vcc (V) -50 - 100 125 Tc (°C) - 100 125 Tc (°C) VND830SP 150 175 150 175 ...
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... VND830SP Figure 19. Status leakage current Ilstat (uA) 0.05 0.04 Vstat=5V 0.03 0.02 0.01 0 -50 - (°C) Figure 21. Status clamp voltage Vscl (V) 8 7.8 Istat=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C) Figure 23. Open-load off-state detection threshold Vol (V) 5 4.5 Vin= ...
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... STATUS1 INPUT1 STATUS2 INPUT2 V GND GND ) S(on)max ) / (-I ) GND (when V < 0 during reverse battery situations) is: GND GND Doc ID 7380 Rev OUTPUT1 OUTPUT2 GND R GND D GND only) GND resistor: becomes the sum of the S(on)max VND830SP D ld ...
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... VND830SP Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same R If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below ...
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... Olmin / ( ))R < Olmin. out V batt DRIVER + LOGIC + GROUND Doc ID 7380 Rev 4 ) connected between PU ) like the +5V line used to supply the has to be higher than OUT < OLmax L(off2) is pulled high (up to several mA), the pull L(off2) OUT R L VND830SP . ...
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... VND830SP 3.5 Maximum demagnetization energy (V Figure 26. Maximum turn-off current versus load inductance (A) 100 single pulse repetitive pulse repetitive pulse Note: Values are generated with R In case of repetitive pulses, T must not exceed the temperature specified above for curves B and C. 1 L(mH) = 150º ...
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... Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 2 8cm ). Figure 28. R thj-amb RTHj_amb (°C/ 20/27 and Z measurements (PCB FR4 area = mm, PCB PCB copper area in open box free air condition 2 4 PCB Cu heatsink area (cm^2) Doc ID 7380 Rev 4 VND830SP Tj-Tamb=50° ...
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... VND830SP Figure 29. Thermal impedance junction ambient single pulse Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 Z 1 – THtp Pd2 Doc ID 7380 Rev 4 Package and PCB thermal data T_amb 21/27 ...
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... Package and PCB thermal data Table 14. Thermal parameters Area / island (cm 22/ (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 7380 Rev 4 VND830SP Footprint 6 0.15 0.8 0.7 0 0.0006 2.1E-03 0.013 0.3 0. ...
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... VND830SP 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSO-10 package information Figure 31 ...
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... Doc ID 7380 Rev 4 VND830SP Max. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 1.35 1.40 14.40 14.35 1 ...
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... VND830SP 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter ...
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... Revision history table insertion (page 18). Disclaimers update (page 19). Document reformatted and restructured. 3 Added contents, list of tables and figures. Added Section 5.1: ECOPACK Changed document template. 4 Updated Figure 5: Switching characteristics Updated Table 8: Switching (V Doc ID 7380 Rev 4 VND830SP Changes ® packages information. = 13V 25°C) CC ...
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... VND830SP Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...